Inventor · disambiguated record
Jyh-Nan Lin
Also filed as: LIN JYH-NAN
14 granted patents·8 pending applications·8 citations·filing 2012–2025
87Inventor score
Top patents by PatentIndex Score
22 records- 0191US11315829B2Amorphous layers for reducing copper diffusion and method forming sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Apr 26, 2022·2 cites·20 claims
- 0291US11264467B2Semiconductor device having multi-layer diffusion barrier and method of making the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Mar 1, 2022·2 cites·20 claims
- 0390US2025357196A1Electron migration control in interconnect structuresTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 0485US12354908B2Amorphous layers for reducing copper diffusion and method forming sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Granted Jul 8, 2025·0 cites·20 claims
- 0585US2025293084A1Amorphous layers for reducing copper diffusion and method forming sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 0682US10749004B2Semiconductor device having a multi-layer diffusion barrierTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Aug 18, 2020·2 cites·18 claims
- 0781US12444647B2Electron migration control in interconnect structuresTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Oct 14, 2025·0 cites·20 claims
- 0879US11967522B2Amorphous layers for reducing copper diffusion and method forming sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Apr 23, 2024·0 cites·20 claims
- 0976US2024395609A1Method of manufacturing semiconductor device and semiconductor devicesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 1075US12354907B2Electron migration control in interconnect structuresTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Jul 8, 2025·0 cites·20 claims
- 1175US11742393B2Semiconductor device having a multi-layer diffusion barrier and method of making the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Aug 29, 2023·0 cites·20 claims
- 1274US12148656B2Method of manufacturing semiconductor device and semiconductor devicesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Nov 19, 2024·0 cites·20 claims
- 1370US11264273B2Electron migration control in interconnect structuresTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Mar 1, 2022·0 cites·20 claims
- 1463US10373906B2Structure and formation method of interconnection structure of semiconductor deviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Aug 6, 2019·1 cites·20 claims
- 1561US11322397B2Method of manufacturing semiconductor devices including formation of adhesion enhancement layerTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted May 3, 2022·0 cites·20 claims
- 1660US8946095B2Method of forming interlayer dielectric film above metal gate of semiconductor deviceTAIWAN SEMICONDUCTOR MFG·Filed 2012·Granted Feb 3, 2015·1 cites·20 claims
- 1757US2025170597A1Adjustable nozzle deviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Application pending·0 cites
- 1848US2025031399A1Barrier layers in semiconductor devicesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Application pending·0 cites
- 1947US10978337B2Aluminum-containing layers and methods of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Apr 13, 2021·0 cites·20 claims
- 2044US2016071801A1Semiconductor device etching for rc delay improvementTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2014·Application pending·0 cites
- 2139US2015001728A1Pre-treatment method for metal-oxide reduction and device formedTAIWAN SEMICONDUCTOR MFG·Filed 2013·Application pending·0 cites
- 2229US2017053783A1Semiconductor apparatus and cleaning method for the semiconductor apparatusTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Application pending·0 cites
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