Inventor · disambiguated record
Hiroshi Hozoji
Also filed as: HOZOJI HIROSHI
62 granted patents·10 pending applications·1,435 citations·filing 1989–2024
99Inventor score
Top patents by PatentIndex Score
72 records- 0198US5068712ASemiconductor deviceHITACHI LTD·Filed 1989·Granted Nov 26, 1991·165 cites·36 claims
- 0296US10348214B2Power module, power converter device, and electrically powered vehicleHITACHI AUTOMOTIVE SYSTEMS LTD·Filed 2017·Granted Jul 9, 2019·13 cites·10 claims
- 0396US7504720B2Semiconductor unit, and power conversion system and on-vehicle electrical system using the sameHITACHI LTD·Filed 2006·Granted Mar 17, 2009·38 cites·18 claims
- 0496US6780748B2Method of fabricating a wafer level chip size package utilizing a maskless exposureHITACHI LTD·Filed 2002·Granted Aug 24, 2004·150 cites·20 claims
- 0596US6744135B2Electronic apparatusHITACHI LTD·Filed 2002·Granted Jun 1, 2004·104 cites·13 claims
- 0694US8472188B2Semiconductor power module, inverter, and method of manufacturing a power moduleHORIUCHI KEISUKE·Filed 2010·Granted Jun 25, 2013·28 cites·7 claims
- 0793US6791178B2Multi-chip module including semiconductor devices and a wiring substrate for mounting the semiconductor devicesHITACHI LTD·Filed 2001·Granted Sep 14, 2004·77 cites·19 claims
- 0892US8946567B2Power module, power converter device, and electrically powered vehicleNAKATSU KINYA·Filed 2009·Granted Feb 3, 2015·19 cites·14 claims
- 0992US7589400B2Inverter and vehicle drive unit using the sameHITACHI LTD·Filed 2005·Granted Sep 15, 2009·29 cites·4 claims
- 1092US6610934B2Semiconductor module and method of making the deviceHITACHI LTD·Filed 2001·Granted Aug 26, 2003·67 cites·14 claims
- 1190US11139748B2Power module, power converter device, and electrically powered vehicleHITACHI ASTEMO LTD·Filed 2019·Granted Oct 5, 2021·4 cites·3 claims
- 1290US7425762B2Electronic apparatusHITACHI LTD·Filed 2006·Granted Sep 16, 2008·15 cites·5 claims
- 1389US9729076B2Power module, power converter device, and electrically powered vehicleHITACHI AUTOMOTIVE SYSTEMS LTD·Filed 2016·Granted Aug 8, 2017·5 cites·8 claims
- 1488US7955411B2Low temperature bonding material comprising metal particles and bonding methodHITACHI LTD·Filed 2007·Granted Jun 7, 2011·13 cites·22 claims
- 1587US8050037B2Electronic control device using LC module structureHITACHI LTD·Filed 2008·Granted Nov 1, 2011·15 cites·14 claims
- 1687US7542317B2Semiconductor device and power conversion apparatus using the sameHITACHI LTD·Filed 2006·Granted Jun 2, 2009·16 cites·7 claims
- 1786US7816786B2Semiconductor unit, and power conversion system and on-vehicle electrical system using the sameHITACHI LTD·Filed 2009·Granted Oct 19, 2010·12 cites·8 claims
- 1886US6770547B1Method for producing a semiconductor deviceRENESAS TECH CORP·Filed 2000·Granted Aug 3, 2004·40 cites·28 claims
- 1986US6624504B1Semiconductor device and method for manufacturing the sameHITACHI LTD·Filed 2000·Granted Sep 23, 2003·43 cites·24 claims
- 2086US5530286ASemiconductor deviceHITACHI LTD·Filed 1994·Granted Jun 25, 1996·53 cites·6 claims
- 2185US7393771B2Method for mounting an electronic part on a substrate using a liquid containing metal particlesHITACHI LTD·Filed 2004·Granted Jul 1, 2008·33 cites·13 claims
- 2284US7528485B2Semiconductor device, power converter device using it, and hybrid vehicle using the power converter deviceHITACHI LTD·Filed 2005·Granted May 5, 2009·13 cites·8 claims
- 2384US5358904ASemiconductor deviceHITACHI LTD·Filed 1992·Granted Oct 25, 1994·47 cites·15 claims
- 2483US9407163B2Power module, power converter device, and electrically powered vehicleHITACHI AUTOMOTIVE SYSTEMS LTD·Filed 2014·Granted Aug 2, 2016·4 cites·4 claims
- 2583US7145231B2Electronic apparatusHITACHI LTD·Filed 2004·Granted Dec 5, 2006·26 cites·15 claims
- 2683US6930388B2Semiconductor device and method for manufacturing the same and semiconductor device-mounted structureRENESAS TECH CORP·Filed 2001·Granted Aug 16, 2005·37 cites·24 claims
- 2783US6822317B1Semiconductor apparatus including insulating layer having a protrusive portionRENESAS TECH CORP·Filed 2000·Granted Nov 23, 2004·37 cites·16 claims
- 2881US7057283B2Semiconductor device and method for producing the sameHITACHI LTD·Filed 2004·Granted Jun 6, 2006·26 cites·30 claims
- 2980US6326681B1Semiconductor deviceHITACHI LTD·Filed 2000·Granted Dec 4, 2001·14 cites·14 claims
- 3080US5793099ASemiconductor deviceHITACHI LTD·Filed 1996·Granted Aug 11, 1998·30 cites·12 claims
- 3179US6081023ASemiconductor deviceHITACHI LTD·Filed 1999·Granted Jun 27, 2000·28 cites·13 claims
- 3278US5612569ASemiconductor deviceHITACHI LTD·Filed 1995·Granted Mar 18, 1997·35 cites·9 claims
- 3374US9373558B2Resin-sealed electronic control deviceHITACHI LTD·Filed 2013·Granted Jun 21, 2016·3 cites·20 claims
- 3474US6303982B2Semiconductor deviceHITACHI LTD·Filed 2001·Granted Oct 16, 2001·10 cites·28 claims
- 3573US8821676B2Low temperature bonding material comprising coated metal nanoparticles, and bonding methodYASUDA YUSUKE·Filed 2011·Granted Sep 2, 2014·3 cites·7 claims
- 3671US7172130B2Electronic device, rubber product, and methods for manufacturing the sameHITACHI LTD·Filed 2004·Granted Feb 6, 2007·15 cites·24 claims
- 3770US8821768B2Bonding method and bonding material using metal particleYASUDA YUSUKE·Filed 2007·Granted Sep 2, 2014·5 cites·14 claims
- 3869US6130114ASemiconductor deviceHITACHI LTD·Filed 1999·Granted Oct 10, 2000·17 cites·22 claims
- 3969US6018191ASemiconductor deviceHITACHI LTD·Filed 1998·Granted Jan 25, 2000·18 cites·23 claims
- 4067US8723306B2Power semiconductor unit, power module, power semiconductor unit manufacturing method, and power module manufacturing methodTSUYUNO NOBUTAKE·Filed 2011·Granted May 13, 2014·3 cites·14 claims
- 4167US6531760B1Semiconductor deviceFiled 2000·Granted Mar 11, 2003·6 cites·8 claims
- 4267US5914530ASemiconductor deviceHITACHI LTD·Filed 1998·Granted Jun 22, 1999·15 cites·12 claims
- 4364US7002250B2Semiconductor moduleRENESAS TECH CORP·Filed 2001·Granted Feb 21, 2006·14 cites·28 claims
- 4463US6100580ASemiconductor device having all outer leads extending from one side of a resin memberHITACHI LTD·Filed 1998·Granted Aug 8, 2000·17 cites·19 claims
- 4563US6069029ASemiconductor device chip on lead and lead on chip manufacturingHITACHI LTD·Filed 1998·Granted May 30, 2000·13 cites·36 claims
- 4663US2025089356A1Semiconductor deviceAIST·Filed 2024·Application pending·0 cites
- 4761US6072231ASemiconductor deviceHITACHI LTD·Filed 1998·Granted Jun 6, 2000·12 cites·40 claims
- 4859US8847374B2Power semiconductor module and manufacturing method thereofIDE EIICHI·Filed 2011·Granted Sep 30, 2014·1 cites·3 claims
- 4959US7964975B2Metal-resin-boned structured body and resin-encapsulated semiconductor device, and fabrication method for themHITACHI LTD·Filed 2009·Granted Jun 21, 2011·1 cites·6 claims
- 5059US7084498B2Semiconductor device having projected electrodes and structure for mounting the sameRENESAS TECH CORP·Filed 2002·Granted Aug 1, 2006·9 cites·36 claims
Showing the top 50 of 72 patent records by PatentIndex Score.
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