Inventor · disambiguated record
Young-Sang Cho
Also filed as: CHO YOUNG S · CHO YOUNG SANG
32 granted patents·12 pending applications·235 citations·filing 1994–2023
97Inventor score
Files withSAMSUNG ELECTRONICS CO LTD12SAMSUNG ELECTRO MECH11CHO YOUNG-SANG7KOREA INST SCI & TECH4OPTOPAC CO LTD2
Top patents by PatentIndex Score
44 records- 0189US8222089B2Tape for heat dissipating member, chip on film type semiconductor package including heat dissipating member, and electronic apparatus including the sameCHOI KYOUNG-SEI·Filed 2011·Granted Jul 17, 2012·10 cites·12 claims
- 0286US6996305B2Printed circuit board with opto-via holes and process of forming the opto-via holesSAMSUNG ELECTRO MECH·Filed 2003·Granted Feb 7, 2006·32 cites·15 claims
- 0385US7033457B2Method of attaching optical waveguide component to printed circuit boardSAMSUNG ELECTRO MECH·Filed 2005·Granted Apr 25, 2006·13 cites·10 claims
- 0485US6839476B2Multi-layer printed circuit board and the method for coupling optical signals between layers of multi-layer printed circuit boardSAMSUNG ELECTRO MECH·Filed 2003·Granted Jan 4, 2005·32 cites·74 claims
- 0584US10705155B2Memory systems and power management apparatuses including secondary power devices, and related methods of operationSAMSUNG ELECTRONICS CO LTD·Filed 2018·Granted Jul 7, 2020·4 cites·18 claims
- 0682US7915727B2Tape for heat dissipating member, chip on film type semiconductor package including heat dissipating member, and electronic apparatus including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2009·Granted Mar 29, 2011·8 cites·20 claims
- 0782US6409983B1Process for preparing crystalline barium titanate powderKOREA INST SCI & TECH·Filed 2000·Granted Jun 25, 2002·21 cites·5 claims
- 0881US11615604B2Method and apparatus for measuring endolymphatic hydrops ratio of inner ear organ using artificial neural networkSAMSUNG LIFE PUBLIC WELFARE FOUNDATION·Filed 2021·Granted Mar 28, 2023·2 cites·10 claims
- 0980US8575735B2Semiconductor chip and film and TAB package comprising the chip and filmCHO YOUNG-SANG·Filed 2011·Granted Nov 5, 2013·6 cites·12 claims
- 1074US11205604B2Semiconductor package including a thermal conductive layer and method of manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2018·Granted Dec 21, 2021·2 cites·16 claims
- 1174US9356450B2Power supply circuits with discharge capability and methods of operating sameSAMSUNG ELECTRONICS CO LTD·Filed 2013·Granted May 31, 2016·5 cites·15 claims
- 1273US8952510B2Semiconductor chip and film and tab package comprising the chip and filmSAMSUNG ELECTRONICS CO LTD·Filed 2013·Granted Feb 10, 2015·3 cites·21 claims
- 1371US6905569B2Method of embedding optical fiber in multilayer printed circuit boardSAMSUNG ELECTRO MECH·Filed 2003·Granted Jun 14, 2005·13 cites·22 claims
- 1467US7589421B2Heat-radiating semiconductor chip, tape wiring substrate and tape package using the sameSAMSUNG ELECTRONICS CO LTD·Filed 2006·Granted Sep 15, 2009·3 cites·34 claims
- 1567US7025849B2Method of attaching optical waveguide component to printed circuit boardSAMSUNG ELECTRO MECH·Filed 2003·Granted Apr 11, 2006·9 cites·10 claims
- 1666US8487437B2Electronic device package and method for fabricating the sameELENIUS PETER·Filed 2010·Granted Jul 16, 2013·3 cites·15 claims
- 1766US8434279B2Method for manufacturing a composite beam using T-type steel and method for constructing a structure using the sameKIM JEOM HAN·Filed 2009·Granted May 7, 2013·4 cites·10 claims
- 1864US6879423B2Printed circuit board assembly with multi-channel block-type optical devices packaged thereinSAMSUNG ELECTRO MECH·Filed 2003·Granted Apr 12, 2005·11 cites·33 claims
- 1962US7508680B2Adjustable-inductance filter, tape distribution substrate comprising the filter, and display panel assembly comprising the tape distribution substrateSAMSUNG ELECTRONICS CO LTD·Filed 2007·Granted Mar 24, 2009·2 cites·26 claims
- 2062US2024123370A1Ion filterHYUNDAI MOTOR CO LTD·Filed 2023·Application pending·0 cites
- 2161US7197202B2Optical printed circuit board for long-distance signal transmissionSAMSUNG ELECTRO MECH·Filed 2003·Granted Mar 27, 2007·7 cites·13 claims
- 2260US7768103B2Tape distribution substrate having pattern for reducing EMISAMSUNG ELECTRONICS CO LTD·Filed 2006·Granted Aug 3, 2010·1 cites·18 claims
- 2359US8506703B2Method and apparatus for forming colloidal photonic crystalsCHO YOUNG-SANG·Filed 2009·Granted Aug 13, 2013·0 cites·9 claims
- 2459US8057598B2Manufacturing equipment for polysilicon ingotCHO YOUNG SANG·Filed 2007·Granted Nov 15, 2011·2 cites·9 claims
- 2558US6978058B2Multi-layer PCB and method for coupling block type multichannel optical signalsSAMSUNG ELECTRO MECH·Filed 2003·Granted Dec 20, 2005·7 cites·44 claims
- 2658US2015335116A1Protective case for mobile deviceSAMSUNG ELECTRONICS CO LTD·Filed 2014·Application pending·0 cites
- 2757US9129972B2Semiconductor packageCHO YOUNG-SANG·Filed 2009·Granted Sep 8, 2015·1 cites·20 claims
- 2857US5441766AMethod for the production of highly pure copper thin films by chemical vapor depositionKOREA INST SCI & TECH·Filed 1994·Granted Aug 15, 1995·20 cites·6 claims
- 2955US7046870B2Method of fabricating multi-layered printed circuit board for optical waveguidesSAMSUNG ELECTRO MECH·Filed 2003·Granted May 16, 2006·4 cites·4 claims
- 3055US2011225927A1Steel-concrete composite beam and construction method using sameCROSS STRUCTURAL CONSULTANT CO LTD·Filed 2009·Application pending·0 cites
- 3154US10030496B2Method for producing synthetic gas by using solid acidKOREA INST SCI & TECH·Filed 2013·Granted Jul 24, 2018·0 cites·17 claims
- 3254US6811704B2Method for anion removal by forming chemical precipitation under an electric field and continuous process for anion removalKOREA INST SCI & TECH·Filed 2002·Granted Nov 2, 2004·6 cites·6 claims
- 3353US2013181343A1Multi-chip package and method of manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2012·Application pending·0 cites
- 3451US7560805B2Semiconductor package and method of manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2007·Granted Jul 14, 2009·0 cites·8 claims
- 3551US2012085383A1Solar cell module and method of manufacturing the sameCHO YOUNG-SANG·Filed 2011·Application pending·0 cites
- 3651US2012085393A1Solar cell module and method of manufacturing the sameCHO YOUNG-SANG·Filed 2011·Application pending·0 cites
- 3750US2009246914A1Semiconductor package and method of manufacturing the sameCHO YOUNG-SANG·Filed 2009·Application pending·0 cites
- 3849US6882161B2Method of measuring dielectric constant of PCB for RIMMSAMSUNG ELECTRO MECH·Filed 2003·Granted Apr 19, 2005·4 cites·5 claims
- 3949US2015318268A1Multi-chip package and method of manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2015·Application pending·0 cites
- 4048US2010122220A1Method of and apparatus for dynamically generating a user presentation based on database stored rulesZEISS CARL MICROIMAGING GMBH·Filed 2009·Application pending·0 cites
- 4147US7350295B2Method of fabricating multi-layered printed circuit board for optical waveguidesSAMSUNG ELECTRO MECH·Filed 2006·Granted Apr 1, 2008·0 cites·28 claims
- 4246US2010053335A1System and method for measuring image quality of moving picturesUNIV SUNGKYUNKWAN FOUND·Filed 2009·Application pending·0 cites
- 4345US2010237498A1Package for semiconductor device and packaging method thereofOPTOPAC CO LTD·Filed 2008·Application pending·0 cites
- 4438US2011260275A1Electronic device package and method of manufacturing the sameOPTOPAC CO LTD·Filed 2011·Application pending·0 cites
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