Inventor · disambiguated record
Brandon C. Hamilton
Also filed as: HAMILTON BRANDON · HAMILTON BRANDON C
22 granted patents·105 citations·filing 2008–2020
92Inventor score
Top patents by PatentIndex Score
22 records- 0196US10454185B1Interferometric direction finding antennaROCKWELL COLLINS INC·Filed 2017·Granted Oct 22, 2019·45 cites·23 claims
- 0288US9545043B1Shielding encapsulation for electrical circuitryHAMILTON BRANDON C·Filed 2010·Granted Jan 10, 2017·18 cites·17 claims
- 0387US8119040B2Glass thick film embedded passive materialLOWER NATHAN P·Filed 2008·Granted Feb 21, 2012·13 cites·18 claims
- 0486US8822844B1Shielding and potting for electrical circuitsDIMKE MARK T·Filed 2010·Granted Sep 2, 2014·16 cites·8 claims
- 0577US11474576B1Electrical device with thermally controlled performanceROCKWELL COLLINS INC·Filed 2019·Granted Oct 18, 2022·3 cites·19 claims
- 0667US10727203B1Die-in-die-cavity packagingROCKWELL COLLINS INC·Filed 2018·Granted Jul 28, 2020·1 cites·18 claims
- 0766US9355544B1Method and apparatus for optically storing a binary stateBEAN REGINALD D·Filed 2011·Granted May 31, 2016·3 cites·21 claims
- 0866US8461698B1PCB external ground plane via conductive coatingHAMILTON BRANDON C·Filed 2010·Granted Jun 11, 2013·3 cites·6 claims
- 0964US11233030B1Microfluidic manufactured mesoscopic microelectronics interconnectROCKWELL COLLINS INC·Filed 2017·Granted Jan 25, 2022·1 cites·20 claims
- 1055US8585937B2Glass thick film embedded passive materialLOWER NATHAN P·Filed 2012·Granted Nov 19, 2013·0 cites·11 claims
- 1150US11626286B1Custom photolithography masking via precision dispense processROCKWELL COLLINS INC·Filed 2020·Granted Apr 11, 2023·0 cites·12 claims
- 1250US11236436B2Controlled induced warping of electronic substrates via electroplatingROCKWELL COLLINS INC·Filed 2020·Granted Feb 1, 2022·0 cites·14 claims
- 1349US11515225B2Reconstituted wafer including mold material with recessed conductive featureROCKWELL COLLINS INC·Filed 2020·Granted Nov 29, 2022·0 cites·18 claims
- 1448US11469373B2System and device including memristor materialROCKWELL COLLINS INC·Filed 2020·Granted Oct 11, 2022·0 cites·19 claims
- 1548US11239182B2Controlled induced warping of electronic substratesROCKWELL COLLINS INC·Filed 2020·Granted Feb 1, 2022·0 cites·12 claims
- 1647US11749539B1Maskless etching of electronic substrates via precision dispense processROCKWELL COLLINS INC·Filed 2020·Granted Sep 5, 2023·0 cites·7 claims
- 1747US11605570B2Reconstituted wafer including integrated circuit die mechanically interlocked with mold materialROCKWELL COLLINS INC·Filed 2020·Granted Mar 14, 2023·0 cites·12 claims
- 1846US11462267B2System and device including memristor materialROCKWELL COLLINS INC·Filed 2020·Granted Oct 4, 2022·0 cites·17 claims
- 1945US11276641B1Conformal multi-plane material depositionROCKWELL COLLINS INC·Filed 2020·Granted Mar 15, 2022·0 cites·11 claims
- 2043US11456418B2System and device including memristor materials in parallelROCKWELL COLLINS INC·Filed 2020·Granted Sep 27, 2022·0 cites·12 claims
- 2141US11631808B2System and device including memristor materialROCKWELL COLLINS INC·Filed 2020·Granted Apr 18, 2023·0 cites·9 claims
- 2225USD811878SKeg cap holderKEGCAPMAGNET LLC·Filed 2016·Granted Mar 6, 2018·2 cites·1 claims
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