Inventor · disambiguated record
Hirohito Miyashita
Also filed as: MIYASHITA HIROHITO
22 granted patents·359 citations·filing 1986–2018
96Inventor score
Top patents by PatentIndex Score
22 records- 0192US8246764B2Copper alloy sputtering target and semiconductor element wiringOKABE TAKEO·Filed 2009·Granted Aug 21, 2012·10 cites·14 claims
- 0292US7618505B2Target of high-purity nickel or nickel alloy and its producing methodNIPPON MINING CO·Filed 2006·Granted Nov 17, 2009·11 cites·4 claims
- 0390US6858116B2Sputtering target producing few particles, backing plate or sputtering apparatus and sputtering method producing few particlesNIKKO MATERIALS CO LTD·Filed 2001·Granted Feb 22, 2005·41 cites·19 claims
- 0489US6759143B2Tantalum or tungsten target-copper alloy backing plate assembly and production method thereforNIKKO MATERIALS CO LTD·Filed 2001·Granted Jul 6, 2004·39 cites·2 claims
- 0587US8177947B2Sputtering targetMIYASHITA HIROHITO·Filed 2006·Granted May 15, 2012·10 cites·15 claims
- 0687US7507304B2Copper alloy sputtering target and semiconductor element wiringNIPPON MINING CO·Filed 2003·Granted Mar 24, 2009·23 cites·10 claims
- 0786US6793124B1Diffusion-joined target assemly of high-purity cobalt target and copper alloy backing plate and production method thereforNIKKO MATERIALS CO LTD·Filed 2001·Granted Sep 21, 2004·30 cites·2 claims
- 0885US6582535B1Tungsten target for sputtering and method for preparing thereofNIKKO MATERIALS CO LTD·Filed 2000·Granted Jun 24, 2003·34 cites·1 claims
- 0983US6723183B2Silicide target for depositing less embrittling gate oxide and method of manufacturing silicide targetNIKKO MATERIALS CO LTD·Filed 2001·Granted Apr 20, 2004·32 cites·16 claims
- 1082US4666667AHigh-strength, high-conductivity copper alloyNIPPON MINING CO·Filed 1986·Granted May 19, 1987·32 cites·6 claims
- 1179US7138040B2Electrolytic copper plating method, phosphorous copper anode for electrolytic plating method, and semiconductor wafer having low particle adhesion plated with said method and anodeNIPPON MINING CO·Filed 2002·Granted Nov 21, 2006·12 cites·14 claims
- 1277US9685307B2Sputtering target, sputtering target-backing plate assembly and deposition systemMIYASHITA HIROHITO·Filed 2005·Granted Jun 20, 2017·5 cites·3 claims
- 1377US6153315ASputtering target and method for manufacturing thereofJAPAN ENERGY CORP·Filed 1998·Granted Nov 28, 2000·44 cites·8 claims
- 1476US10665462B2Copper alloy sputtering target and semiconductor element wiringJX NIPPON MINING & METALS CORP·Filed 2018·Granted May 26, 2020·0 cites·7 claims
- 1575US8262816B2Hafnium alloy targetOKABE TAKEO·Filed 2008·Granted Sep 11, 2012·3 cites·2 claims
- 1675US8241438B2Hafnium alloy targetOKABE TAKEO·Filed 2008·Granted Aug 14, 2012·3 cites·2 claims
- 1775US8062440B2Hafnium alloy target and process for producing the sameOKABE TAKEO·Filed 2008·Granted Nov 22, 2011·3 cites·5 claims
- 1875US7740718B2Target of high-purity nickel or nickel alloy and its producing methodNIPPON MINING CO·Filed 2002·Granted Jun 22, 2010·7 cites·12 claims
- 1972US6875325B2Sputtering target producing few particlesNIKKO MATERIALS CO LTD·Filed 2001·Granted Apr 5, 2005·11 cites·11 claims
- 2062US7459036B2Hafnium alloy target and process for producing the sameNIPPON MINING CO·Filed 2004·Granted Dec 2, 2008·5 cites·2 claims
- 2158US9472383B2Copper or copper alloy target/copper alloy backing plate assemblyOKABE TAKEO·Filed 2004·Granted Oct 18, 2016·3 cites·10 claims
- 2244US9896745B2Copper alloy sputtering target and method for manufacturing the targetOKABE TAKEO·Filed 2002·Granted Feb 20, 2018·1 cites·14 claims
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