Inventor · disambiguated record
Sung Sik Jang
Also filed as: JANG SUNG SIK
10 granted patents·205 citations·filing 2000–2014
90Inventor score
Top patents by PatentIndex Score
10 records- 0189US6525406B1Semiconductor device having increased moisture path and increased solder joint strengthAMKOR TECHNOLOGY INC·Filed 2000·Granted Feb 25, 2003·69 cites·43 claims
- 0284US7042068B2Leadframe and semiconductor package made using the leadframeAMKOR TECHNOLOGY INC·Filed 2001·Granted May 9, 2006·32 cites·18 claims
- 0382US6555899B1Semiconductor package leadframe assembly and method of manufactureAMKOR TECHNOLOGY INC·Filed 2000·Granted Apr 29, 2003·34 cites·19 claims
- 0479US8410585B2Leadframe and semiconductor package made using the leadframeAHN BYUNG HOON·Filed 2006·Granted Apr 2, 2013·9 cites·20 claims
- 0579US6853059B1Semiconductor package having improved adhesiveness and ground bondingAMKOR TECHNOLOGY INC·Filed 2000·Granted Feb 8, 2005·24 cites·20 claims
- 0673US9699638B2Apparatus and method for providing integrated device informationSAMSUNG ELECTRONICS CO LTD·Filed 2014·Granted Jul 4, 2017·3 cites·18 claims
- 0770US6867071B1Leadframe including corner leads and semiconductor package using sameAMKOR TECHNOLOGY INC·Filed 2002·Granted Mar 15, 2005·22 cites·25 claims
- 0868US7535085B2Semiconductor package having improved adhesiveness and ground bondingAMKOR TECHNOLOGY INC·Filed 2006·Granted May 19, 2009·3 cites·20 claims
- 0963US7067908B2Semiconductor package having improved adhesiveness and ground bondingAMKOR TECHNOLOGY INC·Filed 2004·Granted Jun 27, 2006·9 cites·11 claims
- 1053US9362210B2Leadframe and semiconductor package made using the leadframeAMKOR TECHNOLOGY INC·Filed 2013·Granted Jun 7, 2016·0 cites·20 claims
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →