Inventor · disambiguated record
Seiji Yasuda
Also filed as: YASUDA SEIJI
9 granted patents·2 pending applications·190 citations·filing 1980–2008
88Inventor score
Files withTOKYO SHIBAURA ELECTRIC CO3AGENCY IND SCIENCE TECHN2NAT INST OF ADVANCED IND SCIEN2UNIV TOHOKU NAT UNIV CORP2TOSHIBA KK1
Top patents by PatentIndex Score
11 records- 0190US6465512B2Leukemic cell growth inhibiting methodNAT INST OF ADVANCED IND SCIEN·Filed 2000·Granted Oct 15, 2002·66 cites·8 claims
- 0281US4589004ASemiconductor device monolithically comprising a V-MOSFET and bipolar transistor isolated from each otherTOKYO SHIBAURA ELECTRIC CO·Filed 1984·Granted May 13, 1986·54 cites·3 claims
- 0376US6420171B1Leukemic cell-adsorbing material containing lectin protein from Agrocybe cylindracea or jequirity plant seedAGENCY IND SCIENCE TECHN·Filed 2000·Granted Jul 16, 2002·7 cites·13 claims
- 0476US4968932AEvaluation method for semiconductor deviceTOSHIBA KK·Filed 1988·Granted Nov 6, 1990·33 cites·4 claims
- 0561US7923819B2Interlayer insulating film, wiring structure and electronic device and methods of manufacturing the sameUNIV TOHOKU NAT UNIV CORP·Filed 2007·Granted Apr 12, 2011·1 cites·16 claims
- 0645US2010101834A1Interlayer insulation film, interconnect structure, and methods of manufacturing themUNIV TOHOKU NAT UNIV CORP·Filed 2008·Application pending·0 cites
- 0744US4566174ASemiconductor device and method for manufacturing the sameTOKYO SHIBAURA ELECTRIC CO·Filed 1983·Granted Jan 28, 1986·11 cites·6 claims
- 0837US4403392AMethod of manufacturing a semiconductor deviceTOKYO SHIBAURA ELECTRIC CO·Filed 1980·Granted Sep 13, 1983·9 cites·8 claims
- 0935US4530768AMethod for the disposal of waste water containing iron-cyanide complexesAGENCY IND SCIENCE TECHN·Filed 1984·Granted Jul 23, 1985·9 cites·12 claims
- 1026US6987022B2Leukemic cell-adsorbing material containing lectin protein from Dolichos beans or soybeansNAT INST OF ADVANCED IND SCIEN·Filed 2002·Granted Jan 17, 2006·0 cites·12 claims
- 1126US2003081363A1ESD protection device and method of manufacturing the deviceFiled 2002·Application pending·0 cites
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