Inventor · disambiguated record
Myung-Sung Kang
Also filed as: KANG MYUNG-SUNG
11 granted patents·3 pending applications·29 citations·filing 2009–2024
86Inventor score
Top patents by PatentIndex Score
14 records- 0191US12183653B2Thermal conductive filmSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted Dec 31, 2024·2 cites·20 claims
- 0285US9991234B2Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2017·Granted Jun 5, 2018·5 cites·20 claims
- 0384US11355413B2Adhesive film, semiconductor apparatus using the same, and semiconductor package including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2019·Granted Jun 7, 2022·4 cites·22 claims
- 0482US7807507B2Backgrinding-underfill film, method of forming the same, semiconductor package using the backgrinding-underfill film, and method of forming the semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2009·Granted Oct 5, 2010·8 cites·19 claims
- 0580US10043780B2Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2017·Granted Aug 7, 2018·3 cites·16 claims
- 0679US10354985B2Semiconductor device having stacked semiconductor chips and method for fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2017·Granted Jul 16, 2019·3 cites·20 claims
- 0777US10923465B2Semiconductor device having stacked semiconductor chips and method for fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2019·Granted Feb 16, 2021·2 cites·17 claims
- 0873US8958011B2Bi-directional camera module and flip chip bonder including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2013·Granted Feb 17, 2015·2 cites·15 claims
- 0961US2025259866A1Device for removing void in underfill materialSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 1056US2024178188A1Semiconductor package and method of fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
- 1152US10446525B2Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2018·Granted Oct 15, 2019·0 cites·20 claims
- 1248US10910339B2Flip chip bonding methodSAMSUNG ELECTRONICS CO LTD·Filed 2019·Granted Feb 2, 2021·0 cites·19 claims
- 1343US11656148B2Elastic material vibration test apparatusHYUNDAI MOTOR CO LTD·Filed 2020·Granted May 23, 2023·0 cites·5 claims
- 1434US2013032947A1Semiconductor package and method of manufacturing the samePARK SANG-SICK·Filed 2012·Application pending·0 cites
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