Inventor · disambiguated record
Taide Tan
Also filed as: Tan Taide
7 granted patents·3 pending applications·19 citations·filing 2015–2024
81Inventor score
Files withLAM RES CORP10
Top patents by PatentIndex Score
10 records- 0197US11608559B2Integrated showerhead with thermal control for delivering radical and precursor gas to a downstream chamber to enable remote plasma film depositionLAM RES CORP·Filed 2021·Granted Mar 21, 2023·6 cites·20 claims
- 0294US11101164B2Integrated showerhead with thermal control for delivering radical and precursor gas to a downstream chamber to enable remote plasma film depositionLAM RES CORP·Filed 2020·Granted Aug 24, 2021·3 cites·24 claims
- 0393US12000047B2Integrated showerhead with thermal control for delivering radical and precursor gas to a downstream chamber to enable remote plasma film depositionLAM RES CORP·Filed 2023·Granted Jun 4, 2024·1 cites·20 claims
- 0493US10604841B2Integrated showerhead with thermal control for delivering radical and precursor gas to a downstream chamber to enable remote plasma film depositionLAM RES CORP·Filed 2016·Granted Mar 31, 2020·7 cites·24 claims
- 0589US11674226B2Separation of plasma suppression and wafer edge to improve edge film thickness uniformityLAM RES CORP·Filed 2020·Granted Jun 13, 2023·2 cites·17 claims
- 0687US12331402B2Integrated showerhead with thermal control for delivering radical and precursor gas to a downstream chamber to enable remote plasma film depositionLAM RES CORP·Filed 2024·Granted Jun 17, 2025·0 cites·20 claims
- 0772US2023323535A1Separation of plasma suppression and wafer edge to improve edge film thickness uniformityLAM RES CORP·Filed 2023·Application pending·0 cites
- 0851US2017002465A1Separation of Plasma Suppression and Wafer Edge to Improve Edge Film Thickness UniformityLAM RES CORP·Filed 2015·Application pending·0 cites
- 0933US11004662B2Temperature controlled spacer for use in a substrate processing chamberLAM RES CORP·Filed 2017·Granted May 11, 2021·0 cites·26 claims
- 1033US2016289827A1Plasma processing systems and structures having sloped confinement ringsLAM RES CORP·Filed 2015·Application pending·0 cites
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