Inventor · disambiguated record
Meng-Wei Chiang
Also filed as: CHIANG MENG-WEI
3 granted patents·8 citations·filing 2020–2023
64Inventor score
Technology areasH10W
Files withTAIWAN SEMICONDUCTOR MFG CO LTD3
Top patents by PatentIndex Score
3 records- 0196US11080455B1Layout design of integrated circuit with through-substrate viaTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Aug 3, 2021·4 cites·20 claims
- 0294US12223250B2Method of manufacturing integrated circuit having through-substrate viaTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Feb 11, 2025·2 cites·20 claims
- 0392US11748544B2Method of manufacturing integrated circuit having through-substrate viaTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Sep 5, 2023·2 cites·8 claims
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