Inventor · disambiguated record
He Luan
Also filed as: Luan he
13 granted patents·5 pending applications·12 citations·filing 2016–2020
84Inventor score
Top patents by PatentIndex Score
18 records- 0190US10474134B2Systems and methods for compensating for 3D shape deviations in additive manufacturingUNIV SOUTHERN CALIFORNIA·Filed 2016·Granted Nov 12, 2019·7 cites·15 claims
- 0280US11669057B2Neural network thermal behavior predictionsHEWLETT PACKARD DEVELOPMENT CO·Filed 2017·Granted Jun 6, 2023·1 cites·13 claims
- 0377US11597156B2Monitoring additive manufacturingHEWLETT PACKARD DEVELOPMENT CO·Filed 2018·Granted Mar 7, 2023·3 cites·13 claims
- 0474US11967037B2Object deformation determinationHEWLETT PACKARD DEVELOPMENT CO·Filed 2020·Granted Apr 23, 2024·1 cites·7 claims
- 0560US12459041B2Porosity predictionPERIDOT PRINT LLC·Filed 2019·Granted Nov 4, 2025·0 cites·10 claims
- 0658US11971689B2Object manufacturing visualizationHEWLETT PACKARD DEVELOPMENT CO·Filed 2018·Granted Apr 30, 2024·0 cites·15 claims
- 0754US12125187B2Enhancing interpolated thermal imagesHEWLETT PACKARD DEVELOPMENT CO·Filed 2019·Granted Oct 22, 2024·0 cites·14 claims
- 0853US12350887B2Adaptive thermal diffusivityPERIDOT PRINT LLC·Filed 2019·Granted Jul 8, 2025·0 cites·20 claims
- 0953US11931967B2Material phase detection in additive manufacturingHEWLETT PACKARD DEVELOPMENT CO·Filed 2019·Granted Mar 19, 2024·0 cites·15 claims
- 1052US12229890B2Model predictionHEWLETT PACKARD DEVELOPMENT CO·Filed 2020·Granted Feb 18, 2025·0 cites·15 claims
- 1151US11971699B2Thermal mappingHEWLETT PACKARD DEVELOPMENT CO·Filed 2018·Granted Apr 30, 2024·0 cites·14 claims
- 1248US11878464B2Predicting thermal behavior in 3D printersHEWLETT PACKARD DEVELOPMENT CO·Filed 2018·Granted Jan 23, 2024·0 cites·11 claims
- 1347US12373618B2Adaptive simulation in additive manufacturingPERIDOT PRINT LLC·Filed 2019·Granted Jul 29, 2025·0 cites·13 claims
- 1446US2023051704A1Object deformationsHEWLETT PACKARD DEVELOPMENT CO·Filed 2020·Application pending·0 cites
- 1546US2022152936A1Generating thermal imagesHEWLETT PACKARD DEVELOPMENT CO·Filed 2019·Application pending·0 cites
- 1643US2022413464A1Registering objectsHEWLETT PACKARD DEVELOPMENT CO·Filed 2019·Application pending·0 cites
- 1742US2021056426A1Generation of kernels based on physical statesHEWLETT PACKARD DEVELOPMENT CO·Filed 2018·Application pending·0 cites
- 1838US2022088878A1Adapting manufacturing simulationHEWLETT PACKARD DEVELOPMENT CO·Filed 2019·Application pending·0 cites
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →