Inventor · disambiguated record
Melanie S. Yajima
Also filed as: YAJIMA MELANIE · YAJIMA MELANIE S · YAJIMA MELANIE SACHIKO
12 granted patents·142 citations·filing 2007–2023
90Inventor score
Top patents by PatentIndex Score
12 records- 0198US9385083B1Wafer-level die to package and die to die interconnects suspended over integrated heat sinksHRL LAB LLC·Filed 2015·Granted Jul 5, 2016·52 cites·14 claims
- 0296US9837372B1Wafer-level die to package and die to die interconnects suspended over integrated heat sinksHRL LAB LLC·Filed 2016·Granted Dec 5, 2017·16 cites·18 claims
- 0396US9508652B1Direct IC-to-package wafer level packaging with integrated thermal heat spreadersHRL LAB LLC·Filed 2015·Granted Nov 29, 2016·25 cites·20 claims
- 0496US9337124B1Method of integration of wafer level heat spreaders and backside interconnects on microelectronics wafersHRL LAB LLC·Filed 2014·Granted May 10, 2016·34 cites·33 claims
- 0588US9825116B1Formation of high-resolution patterns inside deep cavities and applications to RF SI-embedded inductorsHRL LAB LLC·Filed 2015·Granted Nov 21, 2017·5 cites·14 claims
- 0679US7696062B2Method of batch integration of low dielectric substrates with MMICsNORTHROP GRUMMAN SYSTEMS CORP·Filed 2007·Granted Apr 13, 2010·8 cites·20 claims
- 0773US12255047B1Embedded high-z marker material and process for alignment of multilevel ebeam lithographyHRL LAB LLC·Filed 2023·Granted Mar 18, 2025·0 cites·4 claims
- 0867US10305163B2Method and apparatus for semitransparent antenna and transmission linesGM GLOBAL TECH OPERATIONS LLC·Filed 2017·Granted May 28, 2019·1 cites·13 claims
- 0967US10062505B1Laminated conductorsHRL LAB LLC·Filed 2015·Granted Aug 28, 2018·1 cites·12 claims
- 1066US10388454B1Laminated conductorsHRL LAB LLC·Filed 2018·Granted Aug 20, 2019·0 cites·11 claims
- 1160US11823864B1Embedded high-Z marker material and process for alignment of multilevel ebeam lithographyHRL LAB LLC·Filed 2020·Granted Nov 21, 2023·0 cites·14 claims
- 1257US10032851B1Formation of high-resolution patterns inside deep cavities and applications to RF Si-embedded inductorsHRL LAB LLC·Filed 2017·Granted Jul 24, 2018·0 cites·4 claims
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