Inventor · disambiguated record
Jovica Savic
Also filed as: SAVIC JOVICA
24 granted patents·5 pending applications·421 citations·filing 1994–2017
96Inventor score
Top patents by PatentIndex Score
29 records- 0196US6541137B1Multi-layer conductor-dielectric oxide structureMOTOROLA INC·Filed 2000·Granted Apr 1, 2003·133 cites·19 claims
- 0291US6232042B1Method for manufacturing an integral thin-film metal resistorMOTOROLA INC·Filed 1998·Granted May 15, 2001·57 cites·11 claims
- 0388US6349456B1Method of manufacturing photodefined integral capacitor with self-aligned dielectric and electrodesMOTOROLA INC·Filed 1998·Granted Feb 26, 2002·63 cites·14 claims
- 0482US7361847B2Capacitance laminate and printed circuit board apparatus and methodMOTOROLA INC·Filed 2005·Granted Apr 22, 2008·10 cites·2 claims
- 0582US6841080B2Multi-layer conductor-dielectric oxide structureMOTOROLA INC·Filed 2003·Granted Jan 11, 2005·26 cites·7 claims
- 0681US9414497B2Semiconductor package including an embedded circuit component within a support structure of the packageCISCO TECH INC·Filed 2015·Granted Aug 9, 2016·3 cites·16 claims
- 0778US7138068B2Printed circuit patterned embedded capacitance layerMOTOROLA INC·Filed 2005·Granted Nov 21, 2006·6 cites·11 claims
- 0877US7444727B2Method for forming multi-layer embedded capacitors on a printed circuit boardMOTOROLA INC·Filed 2006·Granted Nov 4, 2008·7 cites·9 claims
- 0976US7518465B2Tunable high impedance surface deviceMOTOROLA INC·Filed 2006·Granted Apr 14, 2009·8 cites·15 claims
- 1073US9129908B2Manufacturing a semiconductor package including an embedded circuit component within a support structure of the packageSAVIC JOVICA·Filed 2011·Granted Sep 8, 2015·3 cites·20 claims
- 1173US7056800B2Printed circuit embedded capacitorsMOTOROLA INC·Filed 2003·Granted Jun 6, 2006·17 cites·22 claims
- 1273US6103134ACircuit board features with reduced parasitic capacitance and method thereforMOTOROLA INC·Filed 1998·Granted Aug 15, 2000·37 cites·14 claims
- 1368US10260782B2Heat dissipation in hermetically-sealed packaged devicesCISCO TECH INC·Filed 2017·Granted Apr 16, 2019·1 cites·20 claims
- 1467US7193838B2Printed circuit dielectric foil and embedded capacitorsMOTOROLA INC·Filed 2003·Granted Mar 20, 2007·14 cites·3 claims
- 1567US7038571B2Polymer thick film resistor, layout cell, and methodMOTOROLA INC·Filed 2003·Granted May 2, 2006·12 cites·4 claims
- 1664US9688453B2Heat dissipation in hermetically-sealed packaged devicesCISCO TECH INC·Filed 2015·Granted Jun 27, 2017·1 cites·20 claims
- 1764US7605048B2Method for forming a capacitor having a copper electrode and a high surface area aluminum inner layerKEMET ELECTRONICS CORP·Filed 2007·Granted Oct 20, 2009·2 cites·50 claims
- 1857US7463113B2Apparatus and methods relating to electrically conductive path interfaces disposed within capacitor plate openingsMOTOROLA INC·Filed 2006·Granted Dec 9, 2008·2 cites·19 claims
- 1950US7079373B2Dielectric sheet, method for fabricating the dielectric sheet, printed circuit and patch antenna using the dielectric sheet, and method for fabricating the printed circuitMOTOROLA INC·Filed 2004·Granted Jul 18, 2006·3 cites·12 claims
- 2049US7337528B2Textured dielectric patch antenna fabrication methodMOTOROLA INC·Filed 2004·Granted Mar 4, 2008·6 cites·14 claims
- 2146US7105913B2Two-layer patterned resistorMOTOROLA INC·Filed 2003·Granted Sep 12, 2006·2 cites·9 claims
- 2245US2016064320A1Coupling of an interposer to a package substrateCISCO TECH INC·Filed 2014·Application pending·0 cites
- 2344US7217369B2Meso-microelectromechanical system having a glass beam and method for its fabricationMOTOROLA INC·Filed 2006·Granted May 15, 2007·0 cites·6 claims
- 2443US7451540B2Method for fabricating a printed circuit boardMOTOROLA INC·Filed 2006·Granted Nov 18, 2008·0 cites·15 claims
- 2538US5545430AMethod and reduction solution for metallizing a surfaceMOTOROLA INC·Filed 1994·Granted Aug 13, 1996·8 cites·6 claims
- 2638US2004126484A1Method for forming ceramic film capacitorsFiled 2002·Application pending·0 cites
- 2738US2005134141A1Meso-microelectromechanical system having a glass beam and method for its fabricationFiled 2004·Application pending·0 cites
- 2838US2013015557A1Semiconductor package including an external circuit elementYANG ZHIPING·Filed 2011·Application pending·0 cites
- 2936US2002013997A1Method of manufacture of integral low and high value resistors on a printed circuit boardFiled 2001·Application pending·0 cites
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