Inventor · disambiguated record
Christian Krutzik
Also filed as: KRUTZIK CHRISTIAN
6 granted patents·7 pending applications·201 citations·filing 2004–2019
86Inventor score
Top patents by PatentIndex Score
13 records- 0196US7436494B1Three-dimensional ladar module with alignment reference insert circuitryIRVINE SENSORS CORP·Filed 2007·Granted Oct 14, 2008·115 cites·8 claims
- 0291US8198576B2Three-dimensional LADAR module with alignment reference insert circuitry comprising high density interconnect structureKENNEDY JOHN·Filed 2008·Granted Jun 12, 2012·28 cites·33 claims
- 0389US9111621B2Solid state drive memory device comprising secure erase functionPFG IP LLC·Filed 2013·Granted Aug 18, 2015·23 cites·2 claims
- 0486US9229248B2Electro-active spectacles and associated electronicsMITSUI CHEMICALS INC·Filed 2013·Granted Jan 5, 2016·16 cites·15 claims
- 0569USRE43722EThree-dimensional ladar module with alignment reference insert circuitryKENNEDY JOHN·Filed 2009·Granted Oct 9, 2012·7 cites·32 claims
- 0654US7180579B1Three-dimensional imaging processing module incorporating stacked layers containing microelectronic circuitsIRVINE SENSORS CORP·Filed 2004·Granted Feb 20, 2007·12 cites·12 claims
- 0745US2010177277A1Electro-active spectacles and associated electronicsPIXELOPTICS INC·Filed 2010·Application pending·0 cites
- 0844US2015007337A1Solid State Drive Physical Uncloneable Function Erase Verification Device and MethodKRUTZIK CHRISTIAN·Filed 2014·Application pending·0 cites
- 0941US2020006367A13D-Stacked Module with Unlimited Scalable Memory Architecture for Very High Bandwidth and Very High Capacity Data Processing DevicesIRVINE SENSORS CORP·Filed 2019·Application pending·0 cites
- 1039US2013141137A1Stacked Physically Uncloneable Function Sense and Respond ModuleKRUTZIK CHRISTIAN·Filed 2012·Application pending·0 cites
- 1134US2011096511A1Ultra-low profile multi-chip moduleIRVINE SENSORS CORP·Filed 2010·Application pending·0 cites
- 1234US2012185636A1Tamper-Resistant Memory Device With Variable Data Transmission RateLEON JOHN·Filed 2012·Application pending·0 cites
- 1333US2004188596A1Three-dimensional imaging device incorporating stacked layers containing microelectronic circuitsFiled 2004·Application pending·0 cites
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →