Inventor · disambiguated record
Yoshiaki Yukimori
Also filed as: YUKIMORI YOSHIAKI
7 granted patents·2 pending applications·3 citations·filing 2014–2025
71Inventor score
Top patents by PatentIndex Score
9 records- 0167US2025269451A1Head assembly for mounting conductive ballPROTEC CO LTD·Filed 2025·Application pending·0 cites
- 0265US12325088B2Head assembly for mounting conductive ballPROTEC CO LTD·Filed 2023·Granted Jun 10, 2025·0 cites·16 claims
- 0364US10804239B2Apparatus for mounting conductive ballPROTEC CO LTD·Filed 2019·Granted Oct 13, 2020·1 cites·13 claims
- 0458US9726204B2Fluid pressure actuatorSAMSUNG ELECTRONICS CO LTD·Filed 2014·Granted Aug 8, 2017·1 cites·19 claims
- 0557US12217995B2Method of mounting conductive balls using electrostatic chuckPROTEC CO LTD·Filed 2022·Granted Feb 4, 2025·0 cites·14 claims
- 0656US9508577B2Semiconductor manufacturing apparatuses comprising bonding headsSAMSUNG ELECTRONICS CO LTD·Filed 2014·Granted Nov 29, 2016·1 cites·3 claims
- 0743US2025226237A1Method for mounting bonding material depositsPROTEC CO LTD·Filed 2025·Application pending·0 cites
- 0840US10804240B2Method of mounting conductive ballPROTEC CO LTD·Filed 2019·Granted Oct 13, 2020·0 cites·13 claims
- 0940US9082885B2Semiconductor chip bonding apparatus and method of forming semiconductor device using the sameSAMSUNG ELECTRONICS CO LTD·Filed 2014·Granted Jul 14, 2015·0 cites·20 claims
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →