Inventor · disambiguated record
Hiroyuki Shinogi
Also filed as: SHINOGI HIROYUKI
34 granted patents·5 pending applications·1,362 citations·filing 1999–2009
98Inventor score
Files withSANYO ELECTRIC CO25NOMA TAKASHI3SANYO SEMICONDUCTOR CO LTD3HORIKOSHI KATSU1KITAGAWA KATSUHIKO1
Top patents by PatentIndex Score
39 records- 0198US7256073B2Semiconductor device and manufacturing method thereofSANYO ELECTRIC CO·Filed 2006·Granted Aug 14, 2007·58 cites·9 claims
- 0298US6864172B2Manufacturing method of semiconductor deviceSANYO ELECTRIC CO·Filed 2003·Granted Mar 8, 2005·319 cites·23 claims
- 0396US7662670B2Manufacturing method of semiconductor deviceSANYO ELECTRIC CO·Filed 2006·Granted Feb 16, 2010·61 cites·21 claims
- 0495US7399683B2Manufacturing method of semiconductor deviceSANYO ELECTRIC CO·Filed 2005·Granted Jul 15, 2008·33 cites·28 claims
- 0595US7102238B2Semiconductor device and manufacturing method thereofSANYO ELECTRIC CO·Filed 2004·Granted Sep 5, 2006·49 cites·9 claims
- 0695US6479900B1Semiconductor device and method of manufacturing the sameSANYO ELECTRIC CO·Filed 1999·Granted Nov 12, 2002·209 cites·22 claims
- 0794US7944015B2Semiconductor device and method of manufacturing the sameSANYO ELECTRIC CO·Filed 2008·Granted May 17, 2011·26 cites·3 claims
- 0893US7271466B2Semiconductor device with sidewall wiringSANYO ELECTRIC CO·Filed 2005·Granted Sep 18, 2007·25 cites·7 claims
- 0992US7101735B2Manufacturing method of semiconductor deviceSANYO ELECTRIC CO·Filed 2003·Granted Sep 5, 2006·57 cites·19 claims
- 1091US8102039B2Semiconductor device and manufacturing method thereofNOMA TAKASHI·Filed 2007·Granted Jan 24, 2012·25 cites·8 claims
- 1191US7371693B2Manufacturing method of semiconductor device with chamferingSANYO ELECTRIC CO·Filed 2004·Granted May 13, 2008·40 cites·8 claims
- 1291US6555459B1Method of manufacturing a semiconductor deviceSANYO ELECTRIC CO·Filed 2000·Granted Apr 29, 2003·75 cites·11 claims
- 1391US6534387B1Semiconductor device and method of manufacturing the sameSANYO ELECTRIC CO·Filed 2000·Granted Mar 18, 2003·71 cites·13 claims
- 1491US6326701B1Chip size package and manufacturing method thereofSANYO ELECTRIC CO·Filed 2000·Granted Dec 4, 2001·74 cites·9 claims
- 1590US7719102B2Semiconductor deviceSANYO ELECTRIC CO·Filed 2008·Granted May 18, 2010·13 cites·23 claims
- 1690US7312521B2Semiconductor device with holding memberSANYO ELECTRIC CO·Filed 2003·Granted Dec 25, 2007·49 cites·10 claims
- 1786US6424051B1Semiconductor deviceSANYO ELECTRIC CO·Filed 2000·Granted Jul 23, 2002·45 cites·19 claims
- 1884US7759779B2Semiconductor device and method of manufacturing the sameSANYO SEMICONDUCTOR CO LTD·Filed 2008·Granted Jul 20, 2010·12 cites·5 claims
- 1983US7633133B2Semiconductor device and manufacturing method of the sameSANYO ELECTRIC CO·Filed 2006·Granted Dec 15, 2009·12 cites·10 claims
- 2081US6656758B1Method of manufacturing a chip size packageSANYO ELECTRIC CO·Filed 2000·Granted Dec 2, 2003·32 cites·15 claims
- 2179US7986021B2Semiconductor deviceSANYO ELECTRIC CO·Filed 2006·Granted Jul 26, 2011·9 cites·12 claims
- 2279US7969007B2Semiconductor device and manufacturing method thereofSANYO ELECTRIC CO·Filed 2008·Granted Jun 28, 2011·8 cites·6 claims
- 2375US8373278B2Semiconductor device having stacked dice disposed on base substrateSANYO SEMICONDUCTOR CO LTD·Filed 2008·Granted Feb 12, 2013·6 cites·10 claims
- 2471US6329288B1Semiconductor device and manufacturing method thereofSANYO EELCTRIC CO LTD·Filed 2000·Granted Dec 11, 2001·22 cites·13 claims
- 2566US7589388B2Semiconductor device and method of manufacturing the sameSANYO ELECTRIC CO·Filed 2007·Granted Sep 15, 2009·3 cites·4 claims
- 2665US6717243B2Semiconductor device and the manufacturing method thereofSANYO ELECTRIC CO·Filed 2002·Granted Apr 6, 2004·12 cites·6 claims
- 2764US8686526B2Semiconductor device and method of manufacturing the sameKITAGAWA KATSUHIKO·Filed 2007·Granted Apr 1, 2014·4 cites·15 claims
- 2863US7981807B2Manufacturing method of semiconductor device with smoothingSANYO ELECTRIC CO·Filed 2008·Granted Jul 19, 2011·0 cites·9 claims
- 2962US9034729B2Semiconductor device and method of manufacturing the sameYAMADA HIROSHI·Filed 2007·Granted May 19, 2015·1 cites·9 claims
- 3061US8148811B2Semiconductor device and manufacturing method thereofSHINOGI HIROYUKI·Filed 2007·Granted Apr 3, 2012·3 cites·7 claims
- 3161US8105856B2Method of manufacturing semiconductor device with wiring on side surface thereofNOMA TAKASHI·Filed 2004·Granted Jan 31, 2012·8 cites·3 claims
- 3257US8766408B2Semiconductor device and manufacturing method thereofNOMA TAKASHI·Filed 2007·Granted Jul 1, 2014·1 cites·11 claims
- 3354US2010044821A1Semiconductor device and manufacturing method thereofSANYO ELECTRIC CO·Filed 2009·Application pending·0 cites
- 3449US8044440B2Semiconductor device and method of manufacturing the sameSANYO SEMICONDUCTOR CO LTD·Filed 2009·Granted Oct 25, 2011·0 cites·8 claims
- 3537US8410577B2Semiconductor deviceHORIKOSHI KATSU·Filed 2008·Granted Apr 2, 2013·0 cites·9 claims
- 3637US2004121562A1Method for manufacturing a semiconductor device having multiple laminated layers of different materialsSANYO ELECTRIC CO·Filed 2003·Application pending·0 cites
- 3736US2003011072A1Semiconductor device and the manufacturing method thereofFiled 2002·Application pending·0 cites
- 3836US2003011073A1Semiconductor device and the manufacturing method thereofFiled 2002·Application pending·0 cites
- 3930US2002096757A1Semiconductor device and method of manufacturing the sameFiled 1999·Application pending·0 cites
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →