Inventor · disambiguated record
Thomas P. Dolbear
Also filed as: DOLBEAR THOMAS P
19 granted patents·1 pending application·1,247 citations·filing 1989–2021
96Inventor score
Files withADVANCED MICRO DEVICES INC10MICROELECTRONICS & COMPUTER7ADVANCE MICRO DEVICES INC1HERRELL DENNIS J1
Top patents by PatentIndex Score
20 records- 0194US5926371AHeat transfer apparatus which accommodates elevational disparity across an upper surface of a surface-mounted semiconductor deviceADVANCED MICRO DEVICES INC·Filed 1997·Granted Jul 20, 1999·167 cites·34 claims
- 0294US5170930ALiquid metal paste for thermal and electrical connectionsMICROELECTRONICS & COMPUTER·Filed 1991·Granted Dec 15, 1992·168 cites·58 claims
- 0393US5328087AThermally and electrically conductive adhesive material and method of bonding with sameMICROELECTRONICS & COMPUTER·Filed 1993·Granted Jul 12, 1994·155 cites·68 claims
- 0492US5445308AThermally conductive connection with matrix material and randomly dispersed filler containing liquid metalFiled 1994·Granted Aug 29, 1995·153 cites·39 claims
- 0590US5907474ALow-profile heat transfer apparatus for a surface-mounted semiconductor device employing a ball grid array (BGA) device packageADVANCED MICRO DEVICES INC·Filed 1997·Granted May 25, 1999·112 cites·25 claims
- 0688US6828666B1Low inductance power distribution system for an integrated circuit chipADVANCED MICRO DEVICES INC·Filed 1998·Granted Dec 7, 2004·61 cites·19 claims
- 0787US5344795AMethod for encapsulating an integrated circuit using a removable heatsink support blockMICROELECTRONICS & COMPUTER·Filed 1992·Granted Sep 6, 1994·99 cites·32 claims
- 0885US10242962B1Back side metallizationADVANCED MICRO DEVICES INC·Filed 2017·Granted Mar 26, 2019·3 cites·16 claims
- 0984US5963023APower surge management for high performance integrated circuitADVANCED MICRO DEVICES INC·Filed 1998·Granted Oct 5, 1999·73 cites·43 claims
- 1084US4993482ACoiled spring heat transfer elementMICROELECTRONICS & COMPUTER·Filed 1990·Granted Feb 19, 1991·80 cites·23 claims
- 1183US5056706ALiquid metal paste for thermal and electrical connectionsMICROELECTRONICS & COMPUTER·Filed 1989·Granted Oct 15, 1991·59 cites·20 claims
- 1282US6477047B1Temperature sensor mounting for accurate measurement and durabilityADVANCED MICRO DEVICES INC·Filed 2000·Granted Nov 5, 2002·41 cites·25 claims
- 1372US11488922B2Back side metallizationADVANCED MICRO DEVICES INC·Filed 2021·Granted Nov 1, 2022·0 cites·7 claims
- 1467US5309321AThermally conductive screen mesh for encapsulated integrated circuit packagesMICROELECTRONICS & COMPUTER·Filed 1992·Granted May 3, 1994·37 cites·31 claims
- 1563US5265321AIntegrated circuit structure with heat exchanger elements secured thereto and method of makingMICROELECTRONICS & COMPUTER·Filed 1992·Granted Nov 30, 1993·32 cites·20 claims
- 1662US10957669B2Back side metallizationADVANCED MICRO DEVICES INC·Filed 2019·Granted Mar 23, 2021·0 cites·5 claims
- 1761US10431562B1Back side metallizationADVANCED MICRO DEVICES INC·Filed 2019·Granted Oct 1, 2019·0 cites·12 claims
- 1858US6462956B1Arrangement for reducing non-uniformity in current flow through various power pins within a printed wiring board connector for a removable moduleADVANCED MICRO DEVICES INC·Filed 2000·Granted Oct 8, 2002·7 cites·45 claims
- 1938US8198723B1Low inductance power distribution system for an integrated circuit chipHERRELL DENNIS J·Filed 2004·Granted Jun 12, 2012·0 cites·48 claims
- 2028US2003085453A1Flip chip semiconductor devices and heat sink assemblies, and the coupling thereof to form an electronic apparatus including a compliant support for supporting a heat sinkADVANCE MICRO DEVICES INC·Filed 2002·Application pending·0 cites
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →