Inventor · disambiguated record
Erik Heinemann
Also filed as: HEINEMANN ERIK
12 granted patents·8 pending applications·129 citations·filing 1997–2023
90Inventor score
Files withINFINEON TECHNOLOGIES AG10AMS OSRAM INT GMBH5JEREBIC SIMON2SIEMENS AG2AVAGO TECH FIBER IP SG PTE LTD1
Top patents by PatentIndex Score
20 records- 0189US7605453B2Chip module and chip cardINFINEON TECHNOLOGIES AG·Filed 2006·Granted Oct 20, 2009·26 cites·36 claims
- 0285US7731433B1Optoelectronic surface-mounted device and method for forming an optoelectronic surface-mounted deviceAVAGO TECH FIBER IP SG PTE LTD·Filed 2008·Granted Jun 8, 2010·18 cites·12 claims
- 0378US7019981B2Making contact with semiconductor chips in chip cardsINFINEON TECHNOLOGIES AG·Filed 2004·Granted Mar 28, 2006·27 cites·20 claims
- 0471US7069652B2Method for producing laminated smart cardsINFINEON TECHNOLOGIES AG·Filed 2002·Granted Jul 4, 2006·15 cites·5 claims
- 0571USD405779SCarrier element for a semiconductor chip for integration into a chipcardSIEMENS AG·Filed 1997·Granted Feb 16, 1999·17 cites·1 claims
- 0661US2025210941A1Stacked laser arrangement and method for producing sameAMS OSRAM INT GMBH·Filed 2023·Application pending·0 cites
- 0761US2025141180A1Optoelectronic semiconductor component and optoelectronic moduleAMS OSRAM INT GMBH·Filed 2022·Application pending·0 cites
- 0860US6472250B1Method for producing a chip moduleINFINEON TECHNOLOGIES AG·Filed 2000·Granted Oct 29, 2002·10 cites·6 claims
- 0959US2025202190A1Stacked laser assembly and method for creating sameAMS OSRAM INT GMBH·Filed 2023·Application pending·0 cites
- 1058US2025202194A1Laser package and method for determining a laser light offset in a laser packageAMS OSRAM INT GMBH·Filed 2023·Application pending·0 cites
- 1157US2024275127A1Semiconductor chip and componentAMS OSRAM INT GMBH·Filed 2022·Application pending·0 cites
- 1256US6806562B2Device with at least one semiconductor component and a printed circuit board and method of establishing an electromechanical connection between the twoINFINEON TECHNOLOGIES AG·Filed 2002·Granted Oct 19, 2004·6 cites·14 claims
- 1351US6557769B2Smart card module, smart card with the smart card module, and method for producing the smart card moduleINFINEON TECHNOLOGIES AG·Filed 2002·Granted May 6, 2003·3 cites·17 claims
- 1447US2008205012A1Chip card module and method of producing a chip card moduleINFINEON TECHNOLOGIES AG·Filed 2007·Application pending·0 cites
- 1546US2013181247A1Semiconductor Component and Method for Producing a Semiconductor ComponentJEREBIC SIMON·Filed 2011·Application pending·0 cites
- 1641US6992898B2Smart-card module with an anisotropically conductive substrate filmINFINEON TECHNOLOGIES AG·Filed 2002·Granted Jan 31, 2006·0 cites·7 claims
- 1737US9368700B2Optoelectronic component and method for producing an optoelectronic componentJEREBIC SIMON·Filed 2012·Granted Jun 14, 2016·0 cites·13 claims
- 1837US7902683B2Semiconductor arrangement and method for producing a semiconductor arrangementINFINEON TECHNOLOGIES AG·Filed 2006·Granted Mar 8, 2011·0 cites·23 claims
- 1937US6469902B1Adhesive joint assemblySIEMENS AG·Filed 1999·Granted Oct 22, 2002·7 cites·6 claims
- 2037US2004256150A1Nonconducting substrate, forming a strip or a panel, on which a multiplicity of carrier elements are formedINFINEON TECHNOLOGIES AG·Filed 2004·Application pending·0 cites
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →