Inventor · disambiguated record
Kuang-Hui Chen
Also filed as: CHEN KUANG-HUI
11 granted patents·482 citations·filing 2000–2015
92Inventor score
Top patents by PatentIndex Score
11 records- 0196US6252305B1Multichip module having a stacked chip arrangementADVANCED SEMICONDUCTOR ENG·Filed 2000·Granted Jun 26, 2001·137 cites·2 claims
- 0294US6359340B1Multichip module having a stacked chip arrangementADVANCED SEMICONDUCTOR ENG·Filed 2000·Granted Mar 19, 2002·109 cites·15 claims
- 0393US6461897B2Multichip module having a stacked chip arrangementADVANCED SEMICONDUCTOR ENG·Filed 2001·Granted Oct 8, 2002·75 cites·3 claims
- 0492US9144127B1AC-powered LED light engines, integrated circuits and illuminating apparatuses having the sameGROUPS TECH CO LTD·Filed 2015·Granted Sep 22, 2015·17 cites·20 claims
- 0589US6503776B2Method for fabricating stacked chip packageADVANCED SEMICONDUCTOR ENG·Filed 2001·Granted Jan 7, 2003·75 cites·18 claims
- 0686US9345087B2AC-powered LED light engines, integrated circuits and illuminating apparatuses having the sameGROUPS TECH CO LTD·Filed 2014·Granted May 17, 2016·9 cites·19 claims
- 0785US6703075B1Wafer treating method for making adhesive diesCHIPMOS TECHNOLOGIES BERMUDA·Filed 2002·Granted Mar 9, 2004·37 cites·16 claims
- 0882US9107264B2Electronic control gears for LED light engine and application thereofGROUPS TECH CO LTD·Filed 2014·Granted Aug 11, 2015·6 cites·18 claims
- 0974US9288850B2Control circuits, integrated circuits and illuminating apparatuses having the sameGROUPS TECH CO LTD·Filed 2014·Granted Mar 15, 2016·3 cites·20 claims
- 1063USRE42349EWafer treating method for making adhesive diesCHIPMOS TECHNOLOGIES BERMUDA·Filed 2006·Granted May 10, 2011·2 cites·16 claims
- 1163US7023079B2Stacked semiconductor chip packageADVANCED SEMICONDUCTOR ENG·Filed 2002·Granted Apr 4, 2006·12 cites·6 claims
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