Inventor · disambiguated record
Longnan Jin
Also filed as: JIN LONGNAN
4 granted patents·1 pending application·5 citations·filing 2020–2022
63Inventor score
Files withVISHAY GEN SEMICONDUCTOR LLC5
Top patents by PatentIndex Score
5 records- 0192US11450534B2Packaging process for side-wall plating with a conductive filmVISHAY GEN SEMICONDUCTOR LLC·Filed 2020·Granted Sep 20, 2022·4 cites·20 claims
- 0288US11876003B2Semiconductor package and packaging process for side-wall plating with a conductive filmVISHAY GEN SEMICONDUCTOR LLC·Filed 2022·Granted Jan 16, 2024·1 cites·17 claims
- 0367US11764075B2Package assembly for plating with selective moldingVISHAY GEN SEMICONDUCTOR LLC·Filed 2022·Granted Sep 19, 2023·0 cites·18 claims
- 0456US11393699B2Packaging process for plating with selective moldingVISHAY GEN SEMICONDUCTOR LLC·Filed 2020·Granted Jul 19, 2022·0 cites·10 claims
- 0543US2025201653A1Enhanced cooling package for improved thermal management for electrical componentsVISHAY GEN SEMICONDUCTOR LLC·Filed 2021·Application pending·0 cites
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →