Inventor · disambiguated record
Bernd Kolbesen
Also filed as: KOLBESEN BERND · KOLBESEN BERND O
9 granted patents·4 pending applications·87 citations·filing 1981–2012
87Inventor score
Files withSIEMENS AG3INFINEON TECHNOLOGIES AG2ABBADIE ALEXANDRA1AIR PROD & CHEM1FRA UNHOFER GES ZUR FOERDERUNG1
Top patents by PatentIndex Score
13 records- 0190US8361893B2Semiconductor device and substrate with chalcogen doped regionINFINEON TECHNOLOGIES AG·Filed 2011·Granted Jan 29, 2013·10 cites·17 claims
- 0272US9159783B2Semiconductor device and substrate with chalcogen doped regionINFINEON TECHNOLOGIES AG·Filed 2012·Granted Oct 13, 2015·2 cites·16 claims
- 0367US7521408B2Semiconductor cleaning solutionIMEC INTER UNI MICRO ELECTR·Filed 2005·Granted Apr 21, 2009·3 cites·22 claims
- 0464US4680601ASchottky power diodeSIEMENS AG·Filed 1986·Granted Jul 14, 1987·21 cites·6 claims
- 0563US6066609AAqueous solution for cleaning a semiconductor substrateSIEMENS AG·Filed 1999·Granted May 23, 2000·30 cites·18 claims
- 0662US7160482B2Composition comprising an oxidizing and complexing compoundAIR PROD & CHEM·Filed 2001·Granted Jan 9, 2007·8 cites·27 claims
- 0761US7579309B2Methods for characterizing defects on silicon surfaces and etching composition and treatment process thereforSOITEC SILICON ON INSULATOR·Filed 2007·Granted Aug 25, 2009·2 cites·21 claims
- 0853US9063043B2Etching composition, in particular for strained or stressed silicon materials, method for characterizing defects on surfaces of such materials and process of treating such surfaces with the etching compositionABBADIE ALEXANDRA·Filed 2009·Granted Jun 23, 2015·1 cites·18 claims
- 0940US4409075AMethod for cutting a semiconductor crystal into wafersSIEMENS AG·Filed 1981·Granted Oct 11, 1983·10 cites·23 claims
- 1039US2009084760A1Method for removing material from solids and use thereofFRAUNHOFER SESELLSCHAFT ZUR FO·Filed 2007·Application pending·0 cites
- 1133US2009145880A1Liquid jet-guided etching method for removing material from solids and also use thereofMAYER KUNO·Filed 2008·Application pending·0 cites
- 1231US2012094501A1Etching composition, in particular for silicon materials, method for characterizing defects on surfaces of such materials and process of treating such surfaces with the etching compostionMAEHLISS JOCHEN·Filed 2010·Application pending·0 cites
- 1331US2009212020A1Method for Microstructuring Solid SurfacesFRA UNHOFER GES ZUR FOERDERUNG·Filed 2006·Application pending·0 cites
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →