Inventor · disambiguated record
Richard Langlois
Also filed as: LANGLOIS RICHARD · LANGLOIS RICHARD D
12 granted patents·66 citations·filing 2004–2020
88Inventor score
Top patents by PatentIndex Score
12 records- 0194US10295749B1Optical interconnect attach to photonic device with partitioning adhesive functionIBM·Filed 2018·Granted May 21, 2019·13 cites·15 claims
- 0292US10784202B2High-density chip-to-chip interconnection with silicon bridgeIBM·Filed 2017·Granted Sep 22, 2020·33 cites·15 claims
- 0389US9553079B1Flip chip assembly with connected componentIBM·Filed 2015·Granted Jan 24, 2017·7 cites·5 claims
- 0482US10559549B2Gallium liquid metal embrittlement for device reworkIBM·Filed 2017·Granted Feb 11, 2020·2 cites·3 claims
- 0581US10211174B2Flip chip assembly with connected componentIBM·Filed 2017·Granted Feb 19, 2019·3 cites·4 claims
- 0678US11280968B2High-bandwidth embedded optical connector with latching mechanismIBM·Filed 2020·Granted Mar 22, 2022·1 cites·18 claims
- 0776US10338325B1Nanofiller in an optical interfaceIBM·Filed 2018·Granted Jul 2, 2019·2 cites·19 claims
- 0872US8232636B2Reliability enhancement of metal thermal interfaceHUMENIK JAMES N·Filed 2010·Granted Jul 31, 2012·5 cites·24 claims
- 0959US10302869B1Optical interconnect attach to photonic device with partitioning adhesive functionIBM·Filed 2018·Granted May 28, 2019·0 cites·20 claims
- 1053US9984988B2Flip chip assembly with connected componentIBM·Filed 2017·Granted May 29, 2018·0 cites·16 claims
- 1150US10679966B2Gallium liquid metal embrittlement for device reworkIBM·Filed 2017·Granted Jun 9, 2020·0 cites·13 claims
- 1230US7038462B2Method and apparatus for electrical commoning of circuitsIBM·Filed 2004·Granted May 2, 2006·0 cites·20 claims
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