Inventor · disambiguated record
Eiji Kitaura
Also filed as: KITAURA EIJI
11 granted patents·1 pending application·34 citations·filing 1985–2021
85Inventor score
Top patents by PatentIndex Score
12 records- 0192US9947858B2Curable organopolysiloxane composition for transducers and applications of such curable silicone composition for transducersDOW CORNING·Filed 2013·Granted Apr 17, 2018·8 cites·20 claims
- 0287US9879126B2Curable organopolysiloxane composition for transducers and applications of such curable silicone composition for transducersDOW CORNING·Filed 2013·Granted Jan 30, 2018·4 cites·19 claims
- 0378US10604658B2Organic silicon compound, surface treatment agent containing same, resin composition containing same, and gel or cured product of sameDOW CORNING TORAY CO LTD·Filed 2014·Granted Mar 31, 2020·2 cites·19 claims
- 0469US8925626B2Composition for forming filmAKINAGA KEIICHI·Filed 2012·Granted Jan 6, 2015·2 cites·14 claims
- 0565US9175177B2Coating compositionNAGATO MASARU·Filed 2008·Granted Nov 3, 2015·1 cites·8 claims
- 0655US8026313B2Curable polymer compositionDAIKIN IND LTD·Filed 2007·Granted Sep 27, 2011·0 cites·6 claims
- 0753US4659626AMagnetic recording mediumTDK CORP·Filed 1985·Granted Apr 21, 1987·15 cites·7 claims
- 0852US9018306B2Curable fluorine-containing polymer compositionHAYASHI MASAYUKI·Filed 2008·Granted Apr 28, 2015·0 cites·9 claims
- 0951US11139419B2Method for producing sealed optical semiconductor deviceDOW CORNING TORAY CO LTD·Filed 2018·Granted Oct 5, 2021·0 cites·17 claims
- 1047US11257992B2Method for producing sealed optical semiconductor deviceDOW CORNING TORAY CO LTD·Filed 2018·Granted Feb 22, 2022·0 cites·18 claims
- 1147US2024087941A1Integrated dicing die bonding sheet and method for producing semiconductor deviceDOW TORAY CO LTD·Filed 2021·Application pending·0 cites
- 1229US4713278AMagnetic recording mediumTDK CORP·Filed 1986·Granted Dec 15, 1987·2 cites·4 claims
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