Inventor · disambiguated record
Sang-Youp Lee
Also filed as: LEE SANG · LEE SANG Y · LEE SANG-YOUP
12 granted patents·16 pending applications·32 citations·filing 2002–2016
87Inventor score
Files withSAMSUNG ELECTRO MECH11SAMSUNG ELECTRONICS CO LTD4PARK HO-SIK3SOHN KEUNG JIN2LEE BYUNG-CHUL1
Top patents by PatentIndex Score
28 records- 0187US7893527B2Semiconductor plastic package and fabricating method thereofSAMSUNG ELECTRO MECH·Filed 2008·Granted Feb 22, 2011·14 cites·11 claims
- 0277US8647926B2Method of fabricating semiconductor plastic package including a core board, build-up insulation layer, printed circuit, and semiconductor chipSHIN JOON-SIK·Filed 2010·Granted Feb 11, 2014·4 cites·15 claims
- 0370US7451080B2Controlling apparatus and method for bit rateSAMSUNG ELECTRONICS CO LTD·Filed 2005·Granted Nov 11, 2008·3 cites·10 claims
- 0463US8499441B2Method of manufacturing a printed circuit boardPARK JUNG-HWAN·Filed 2008·Granted Aug 6, 2013·2 cites·12 claims
- 0561US8704100B2Heat dissipating substrate and method of manufacturing the sameLEE SANG YOUP·Filed 2010·Granted Apr 22, 2014·2 cites·2 claims
- 0660US8397378B2Manufacturing an insulating sheet, a copper clad laminate, and a printed circuit boardSOHN KEUNG-JIN·Filed 2008·Granted Mar 19, 2013·2 cites·15 claims
- 0759US2012282709A1Method and device for dna sequence analysis using multiple pnaLEE BYUNG CHUL·Filed 2009·Application pending·0 cites
- 0856US8997340B2Method of manufacturing and insulating sheetSOHN KEUNGJIN·Filed 2011·Granted Apr 7, 2015·1 cites·22 claims
- 0955US6912098B2Method for dynamically measuring suspension in-plane and out-plane thermal drift hard disk drivesSAMSUNG ELECTRONICS CO LTD·Filed 2003·Granted Jun 28, 2005·2 cites·7 claims
- 1055US2007006446A1Method of manufacturing head gimbal assemblies, actuators and disk drives by removing thermal pole-tip protrusion at the spin stand levelWANG GENG·Filed 2006·Application pending·0 cites
- 1155US2009250253A1Printed circuit board and manufacturing method thereofSAMSUNG ELECTRO MECH·Filed 2008·Application pending·0 cites
- 1254US7089649B2Method of estimating a thermal pole tip protrusion for a head gimbal assemblySAMSUNG ELECTRONICS CO LTD·Filed 2002·Granted Aug 15, 2006·2 cites·8 claims
- 1353US2012012379A1Printed circuit boardPARK HO-SIK·Filed 2011·Application pending·0 cites
- 1453US2012030938A1Method of manufacturing printed circuit boardPARK HO-SIK·Filed 2011·Application pending·0 cites
- 1553US2012018195A1Printed circuit boardPARK HO-SIK·Filed 2011·Application pending·0 cites
- 1652US8926714B2Heat dissipating substrate and method of manufacturing the sameSAMSUNG ELECTRO MECH·Filed 2014·Granted Jan 6, 2015·0 cites·4 claims
- 1750US2011139499A1Printed circuit board and manufacturing method of the sameSAMSUNG ELECTRO MECH·Filed 2011·Application pending·0 cites
- 1850US2009242248A1Insulating sheet and printed circuit board having the sameSAMSUNG ELECTRO MECH·Filed 2008·Application pending·0 cites
- 1949US8450618B2Printed circuit board with reinforced thermoplastic resin layerSOHN KEUNG-JIN·Filed 2011·Granted May 28, 2013·0 cites·4 claims
- 2048US2009288293A1Metal core package substrate and method for manufacturing the sameSAMSUNG ELECTRO MECH·Filed 2008·Application pending·0 cites
- 2143US2015108029A1Apparatus for receiving substrateSAMSUNG ELECTRO MECH·Filed 2014·Application pending·0 cites
- 2241US7271973B2Flying height compensation for up/down bit error rate trend differenceSAMSUNG ELECTRONICS CO LTD·Filed 2004·Granted Sep 18, 2007·0 cites·10 claims
- 2341US2011127073A1Printed circuit board and manufacturing method thereofSAMSUNG ELECTRO MECH·Filed 2010·Application pending·0 cites
- 2441US2011123772A1Core substrate and method of manufacturing core substrateSAMSUNG ELECTRO MECH·Filed 2010·Application pending·0 cites
- 2536US2011187623A1Universal serial bus type wireless data cardPANTECH CO LTD·Filed 2010·Application pending·0 cites
- 2636US2011126970A1Metallic laminate and manufacturing method of core substrate using the sameSAMSUNG ELECTRO MECH·Filed 2010·Application pending·0 cites
- 2734US2017084528A1Package substrate and manufacturing method thereofSAMSUNG ELECTRO MECH·Filed 2016·Application pending·0 cites
- 2832US2012098859A1Apparatus and method for providing augmented reality user interfaceLEE HEE-JU·Filed 2011·Application pending·0 cites
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →