Inventor · disambiguated record
Jae-Hyun So
Also filed as: SO JAE H · SO JAE-HYUN
10 granted patents·4 pending applications·102 citations·filing 2000–2008
88Inventor score
Files withSAMSUNG ELECTRONICS CO LTD9KANG KYOUNG-MOON1KOREA ADVANCED INST SCI & TECH1SO JAE H1SO JAE-HYUN1
Top patents by PatentIndex Score
14 records- 0194US7261621B2Pad conditioner for chemical mechanical polishing apparatusSAMSUNG ELECTRONICS CO LTD·Filed 2006·Granted Aug 28, 2007·52 cites·23 claims
- 0283US7442111B2Polishing pad, platen, method of monitoring, method of manufacturing, and method of detectingSAMSUNG ELECTRONICS CO LTD·Filed 2007·Granted Oct 28, 2008·8 cites·18 claims
- 0374US7229337B2Polishing pad, platen, method of monitoring, method of manufacturing, and method of detectingSAMSUNG ELECTRONICS CO LTD·Filed 2003·Granted Jun 12, 2007·14 cites·11 claims
- 0474US6432151B1Preparing method of silica slurry for wafer polishingKOREA ADVANCED INST SCI & TECH·Filed 2000·Granted Aug 13, 2002·20 cites·6 claims
- 0569US7429367B2Method for producing improved cerium oxide abrasive particles and compositions including such particlesSAMSUNG ELECTRONICS CO LTD·Filed 2005·Granted Sep 30, 2008·3 cites·37 claims
- 0666US7662022B2Polishing pad, platen, method of monitoring, method of manufacturing, and method of detectingSAMSUNG ELECTRONICS CO LTD·Filed 2008·Granted Feb 16, 2010·2 cites·10 claims
- 0766US7402261B2Slurry compositions, methods of preparing slurry compositions, and methods of polishing an object using slurry compositionsSAMSUNG ELECTRONICS CO LTD·Filed 2005·Granted Jul 22, 2008·2 cites·23 claims
- 0854US8007676B2Slurry compositions, methods of preparing slurry compositions, and methods of polishing an object using slurry compositionsSAMSUNG ELECTRONICS CO LTD·Filed 2008·Granted Aug 30, 2011·0 cites·15 claims
- 0950US7858527B2Additive composition, slurry composition including the same, and method of polishing an object using the slurry compositionSAMSUNG ELECTRONICS CO LTD·Filed 2007·Granted Dec 28, 2010·0 cites·14 claims
- 1045US7288212B2Additive composition, slurry composition including the same, and method of polishing an object using the slurry compositionSAMSUNG ELECTRONICS CO LTD·Filed 2002·Granted Oct 30, 2007·1 cites·8 claims
- 1142US2007037486A1Polishing pad, method of manufacturing the polishing pad, and chemical mechanical polishing apparatus comprising the polishing padKANG KYOUNG-MOON·Filed 2006·Application pending·0 cites
- 1240US2006032147A1Method of preparing slurry composition for chemical mechanical polishingSO JAE-HYUN·Filed 2005·Application pending·0 cites
- 1340US2006032150A1Method for producing improved cerium oxide abrasive particles and compositions including such particlesSO JAE H·Filed 2005·Application pending·0 cites
- 1434US2004023491A1Preparation and use of an abrasive slurry compositionFiled 2003·Application pending·0 cites
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →