Inventor · disambiguated record
Won-Seong Lee
Also filed as: LEE WON-SEONG · LEE WON-SEOUNG
10 granted patents·316 citations·filing 1996–2005
91Inventor score
Files withSAMSUNG ELECTRONICS CO LTD10
Top patents by PatentIndex Score
10 records- 0191US6326282B1Method of forming trench isolation in a semiconductor device and structure formed therebySAMSUNG ELECTRONICS CO LTD·Filed 1999·Granted Dec 4, 2001·105 cites·7 claims
- 0288US6525398B1Semiconductor device capable of preventing moisture-absorption of fuse area thereofSAMSUNG ELECTRONICS CO LTD·Filed 2000·Granted Feb 25, 2003·44 cites·5 claims
- 0386US6607983B1Method of processing a defect source at a wafer edge region in a semiconductor manufacturingSAMSUNG ELECTRONICS CO LTD·Filed 2000·Granted Aug 19, 2003·44 cites·20 claims
- 0480US6399476B2Multilayer passivation process for forming air gaps within a dielectric between interconnectionsSAMSUNG ELECTRONICS CO LTD·Filed 1999·Granted Jun 4, 2002·66 cites·11 claims
- 0571US7517762B2Semiconductor device capable of preventing moisture-absorption of fuse area thereof and method for manufacturing the fuse areaSAMSUNG ELECTRONICS CO LTD·Filed 2005·Granted Apr 14, 2009·4 cites·24 claims
- 0667US5858833AMethods for manufacturing integrated circuit memory devices including trench buried bit linesSAMSUNG ELECTRONICS CO LTD·Filed 1997·Granted Jan 12, 1999·28 cites·19 claims
- 0757US6844240B2Semiconductor device having trench isolationSAMSUNG ELECTRONICS CO LTD·Filed 2001·Granted Jan 18, 2005·6 cites·3 claims
- 0843US6121146AMethod for forming contact plugs of a semiconductor deviceSAMSUNG ELECTRONICS CO LTD·Filed 1998·Granted Sep 19, 2000·10 cites·21 claims
- 0940US6913953B2Semiconductor device capable of preventing moisture absorption of fuse area thereof and method for manufacturing the fuse areaSAMSUNG ELECTRONICS CO LTD·Filed 2002·Granted Jul 5, 2005·0 cites·11 claims
- 1039US5728627AMethods of forming planarized conductive interconnects for integrated circuitsSAMSUNG ELECTRONICS CO LTD·Filed 1996·Granted Mar 17, 1998·9 cites·20 claims
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