Inventor · disambiguated record
Chan Peng Yeen
Also filed as: YEEN CHAN PENG
13 granted patents·149 citations·filing 2000–2009
91Inventor score
Technology areasH10W
Files withNAT SEMICONDUCTOR CORP13
Top patents by PatentIndex Score
13 records- 0183US6448107B1Pin indicator for leadless leadframe packagesNAT SEMICONDUCTOR CORP·Filed 2000·Granted Sep 10, 2002·39 cites·16 claims
- 0276US7598122B1Die attach method and microarray leadframe structureNAT SEMICONDUCTOR CORP·Filed 2006·Granted Oct 6, 2009·7 cites·5 claims
- 0376US7186588B1Method of fabricating a micro-array integrated circuit packageNAT SEMICONDUCTOR CORP·Filed 2004·Granted Mar 6, 2007·27 cites·7 claims
- 0471US7002239B1Leadless leadframe packaging panel featuring peripheral dummy leadsNAT SEMICONDUCTOR CORP·Filed 2003·Granted Feb 21, 2006·19 cites·21 claims
- 0570US7259460B1Wire bonding on thinned portions of a lead-frame configured for use in a micro-array integrated circuit packageNAT SEMICONDUCTOR CORP·Filed 2004·Granted Aug 21, 2007·21 cites·7 claims
- 0664US6677667B1Leadless leadframe package design that provides a greater structural integrityNAT SEMICONDUCTOR CORP·Filed 2000·Granted Jan 13, 2004·11 cites·34 claims
- 0762US7859090B2Die attach method and leadframe structureNAT SEMICONDUCTOR CORP·Filed 2009·Granted Dec 28, 2010·2 cites·8 claims
- 0862US6933223B1Ultra-low loop wire bondingNAT SEMICONDUCTOR CORP·Filed 2004·Granted Aug 23, 2005·12 cites·17 claims
- 0962US6576989B1Locking of mold compound to conductive substrate panelsNAT SEMICONDUCTOR CORP·Filed 2000·Granted Jun 10, 2003·10 cites·21 claims
- 1044US6808961B1Locking of mold compound to conductive substrate panelsNAT SEMICONDUCTOR CORP·Filed 2003·Granted Oct 26, 2004·1 cites·24 claims
- 1140US6818970B1Leadless leadframe package design that provides a greater structural integrityNAT SEMICONDUCTOR CORP·Filed 2003·Granted Nov 16, 2004·0 cites·22 claims
- 1238US6963124B1Locking of mold compound to conductive substrate panelsNAT SEMICONDUCTOR CORP·Filed 2004·Granted Nov 8, 2005·0 cites·22 claims
- 1338US6933174B1Leadless leadframe package design that provides a greater structural integrityNAT SEMICONDUCTOR CORP·Filed 2004·Granted Aug 23, 2005·0 cites·27 claims
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