Inventor · disambiguated record
Hu Ah Lek
Also filed as: LEK HU AH
7 granted patents·61 citations·filing 2000–2004
81Inventor score
Technology areasH10W
Files withNAT SEMICONDUCTOR CORP7
Top patents by PatentIndex Score
7 records- 0183US6448107B1Pin indicator for leadless leadframe packagesNAT SEMICONDUCTOR CORP·Filed 2000·Granted Sep 10, 2002·39 cites·16 claims
- 0264US6677667B1Leadless leadframe package design that provides a greater structural integrityNAT SEMICONDUCTOR CORP·Filed 2000·Granted Jan 13, 2004·11 cites·34 claims
- 0362US6576989B1Locking of mold compound to conductive substrate panelsNAT SEMICONDUCTOR CORP·Filed 2000·Granted Jun 10, 2003·10 cites·21 claims
- 0444US6808961B1Locking of mold compound to conductive substrate panelsNAT SEMICONDUCTOR CORP·Filed 2003·Granted Oct 26, 2004·1 cites·24 claims
- 0540US6818970B1Leadless leadframe package design that provides a greater structural integrityNAT SEMICONDUCTOR CORP·Filed 2003·Granted Nov 16, 2004·0 cites·22 claims
- 0638US6963124B1Locking of mold compound to conductive substrate panelsNAT SEMICONDUCTOR CORP·Filed 2004·Granted Nov 8, 2005·0 cites·22 claims
- 0738US6933174B1Leadless leadframe package design that provides a greater structural integrityNAT SEMICONDUCTOR CORP·Filed 2004·Granted Aug 23, 2005·0 cites·27 claims
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