Inventor · disambiguated record
Fumio Miyajima
Also filed as: MIYAJIMA FUMIO
19 granted patents·2 pending applications·759 citations·filing 1994–2007
96Inventor score
Files withAPIC YAMADA CORP21
Top patents by PatentIndex Score
21 records- 0193US6344162B1Method of manufacturing semiconductor devices and resin molding machineAPIC YAMADA CORP·Filed 1999·Granted Feb 5, 2002·155 cites·13 claims
- 0292US6478562B1Resin molding machineAPIC YAMADA CORP·Filed 2000·Granted Nov 12, 2002·44 cites·3 claims
- 0386US6080354AResin molding method in which a movable cavity piece allows a direct resin feedAPIC YAMADA CORP·Filed 1998·Granted Jun 27, 2000·57 cites·17 claims
- 0484US6743389B2Resin molding machine and method of resin moldingAPIC YAMADA CORP·Filed 2001·Granted Jun 1, 2004·43 cites·8 claims
- 0583US6459159B1Apparatus for sealing a semiconductor device utilizing a release filmAPIC YAMADA CORP·Filed 2000·Granted Oct 1, 2002·25 cites·6 claims
- 0683US5824252AMethod of resin molding and resin molding machine for the sameAPIC YAMADA CORP·Filed 1996·Granted Oct 20, 1998·74 cites·20 claims
- 0782US6350113B1Resin molding machineAPIC YAMADA CORP·Filed 2000·Granted Feb 26, 2002·31 cites·9 claims
- 0882US6261501B1Resin sealing method for a semiconductor deviceAPIC YAMADA CORP·Filed 1999·Granted Jul 17, 2001·56 cites·9 claims
- 0981US6770236B2Method of resin moldingAPIC YAMADA CORP·Filed 2001·Granted Aug 3, 2004·26 cites·10 claims
- 1078US5891483AAutomatic molding machine using release filmAPIC YAMADA CORP·Filed 1996·Granted Apr 6, 1999·41 cites·18 claims
- 1176US6187243B1Method of resin moldingAPIC YAMADA CORP·Filed 1998·Granted Feb 13, 2001·43 cites·10 claims
- 1276US5891384AMethod of operating a molding machine with release filmAPIC YAMADA CORP·Filed 1995·Granted Apr 6, 1999·53 cites·20 claims
- 1374US6048483AResin sealing method for chip-size packagesAPIC YAMADA CORP·Filed 1997·Granted Apr 11, 2000·40 cites·19 claims
- 1468US7407608B2Resin molding equipment and resin molding methodAPIC YAMADA CORP·Filed 2005·Granted Aug 5, 2008·5 cites·16 claims
- 1566US5800841AResin molding machineAPIC YAMADA CORP·Filed 1995·Granted Sep 1, 1998·20 cites·14 claims
- 1661US6444157B1Method of resin moldingAPIC YAMADA CORP·Filed 1998·Granted Sep 3, 2002·17 cites·11 claims
- 1752US6224360B1Resin sealing device for chip-size packagesAPIC YAMADA CORP·Filed 1999·Granted May 1, 2001·15 cites·20 claims
- 1850US7909596B2Resin molding machine and method of resin moldingAPIC YAMADA CORP·Filed 2007·Granted Mar 22, 2011·0 cites·7 claims
- 1950US5507910ALead frame taping machineAPIC YAMADA CORP·Filed 1994·Granted Apr 16, 1996·14 cites·10 claims
- 2042US2007262049A1Imprinting method and nano-imprinting apparatusAPIC YAMADA CORP·Filed 2007·Application pending·0 cites
- 2141US2002017738A1Resin sealing method and resin sealing apparatusAPIC YAMADA CORP·Filed 2001·Application pending·0 cites
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