Inventor · disambiguated record
Hsiao-Hua Peng
Also filed as: PENG HSIAO-HUA
3 granted patents·3 pending applications·5 citations·filing 2018–2024
58Inventor score
Technology areasH10P
Files withTAIWAN SEMICONDUCTOR MFG CO LTD6
Top patents by PatentIndex Score
6 records- 0181US11062886B2Apparatus and method for controlling wafer uniformityTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Jul 13, 2021·4 cites·18 claims
- 0267US11107708B2Heating platform, thermal treatment and manufacturing methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Aug 31, 2021·1 cites·19 claims
- 0362US12142497B2Heating platform, thermal treatment and manufacturing methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Nov 12, 2024·0 cites·20 claims
- 0456US2024387203A1Heating platform, thermal treatment and manufacturing methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 0556US2021296100A1Apparatus and method for controlling wafer uniformityTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Application pending·0 cites
- 0632US2019164852A1System and method for in-line processing controlTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Application pending·0 cites
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →