Inventor · disambiguated record
Chenqian Gan
Also filed as: GAN CHENQIAN
4 granted patents·4 citations·filing 2018–2023
60Inventor score
Files withQUALCOMM INC4
Top patents by PatentIndex Score
4 records- 0181US11011461B2Perpendicular inductors integrated in a substrateQUALCOMM INC·Filed 2019·Granted May 18, 2021·4 cites·15 claims
- 0272US12334252B2Substrate comprising an inductive coupler for signal leakage reductionQUALCOMM INC·Filed 2023·Granted Jun 17, 2025·0 cites·15 claims
- 0362US11823831B2Substrate comprising an inductive coupler for signal leakage reductionQUALCOMM INC·Filed 2019·Granted Nov 21, 2023·0 cites·21 claims
- 0442US11270951B2Substrate comprising at least one patterned ground plane for shieldingQUALCOMM INC·Filed 2018·Granted Mar 8, 2022·0 cites·25 claims
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →