Inventor · disambiguated record
Kuo-Hua Yu
Also filed as: YU KUO-HUA
19 granted patents·7 pending applications·17 citations·filing 2001–2025
89Inventor score
Top patents by PatentIndex Score
26 records- 0185US10510720B2Electronic package and method for fabricating the sameSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2016·Granted Dec 17, 2019·5 cites·30 claims
- 0283US12278189B2Electronic package and manufacturing method thereofSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2023·Granted Apr 15, 2025·0 cites·15 claims
- 0380US2025210527A1Electronic Package and Manufacturing Method ThereofSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2025·Application pending·0 cites
- 0479US11810862B2Electronic package and manufacturing method thereofSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2022·Granted Nov 7, 2023·0 cites·13 claims
- 0575US10756438B2Electronic package and method for fabricating the sameSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2018·Granted Aug 25, 2020·2 cites·7 claims
- 0673US2025246502A1Electronic package and manufacturing method thereofSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2024·Application pending·0 cites
- 0772US11521930B2Electronic package and manufacturing method thereofSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2020·Granted Dec 6, 2022·0 cites·14 claims
- 0869US2025022803A1Electronic package and manufacturing method thereofSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2024·Application pending·0 cites
- 0968US10950520B2Electronic package, method for fabricating the same, and heat dissipatorSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2019·Granted Mar 16, 2021·1 cites·27 claims
- 1067US2025349659A1Electronic package and manufacturing method thereofSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2025·Application pending·0 cites
- 1165US11984379B2Electronic package and manufacturing method thereofSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2021·Granted May 14, 2024·0 cites·26 claims
- 1263US12132003B2Electronic package and manufacturing method thereofSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2022·Granted Oct 29, 2024·0 cites·26 claims
- 1363US11101566B2Method for fabricating electronic packageSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2020·Granted Aug 24, 2021·0 cites·11 claims
- 1460US12400931B2Electronic package and manufacturing method thereofSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2022·Granted Aug 26, 2025·0 cites·20 claims
- 1560US11605554B2Flip-chip process and bonding equipmentSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2021·Granted Mar 14, 2023·0 cites·8 claims
- 1659US12080618B2Electronic package, heat dissipation structure and manufacturing method thereofSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2022·Granted Sep 3, 2024·0 cites·27 claims
- 1758US12387993B2Electronic package and manufacturing method thereofSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2022·Granted Aug 12, 2025·0 cites·14 claims
- 1858US10763237B2Method for manufacturing electronic packageSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2019·Granted Sep 1, 2020·0 cites·12 claims
- 1953US10522500B2Method for manufacturing electronic packageSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2018·Granted Dec 31, 2019·0 cites·12 claims
- 2051US6709741B1FPC adhesive of epoxy resin, onium hexafluoroantimonate, nitrile rubber and fillerTAIFLEX SCIENT CO LTD·Filed 2001·Granted Mar 23, 2004·9 cites·7 claims
- 2149US11289794B2Electronic packageSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2020·Granted Mar 29, 2022·0 cites·8 claims
- 2247US8284838B2Apparatus and related method for decoding video blocks in video picturesGONG JIN-SHENG·Filed 2007·Granted Oct 9, 2012·0 cites·23 claims
- 2342US2006214308A1Flip-chip semiconductor package and method for fabricating the sameSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2006·Application pending·0 cites
- 2439US2020043908A1Package stacked structure, method for fabricating the same, and package structureSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2018·Application pending·0 cites
- 2538US11380978B2Electronic package and method for fabricating the sameSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2018·Granted Jul 5, 2022·0 cites·27 claims
- 2636US2018130774A1Package stack structureSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2017·Application pending·0 cites
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →