Inventor · disambiguated record
Duyeul Kim
Also filed as: KIM DUYEUL
7 granted patents·30 citations·filing 2015–2022
83Inventor score
Technology areasH10W
Files withSAMSUNG ELECTRONICS CO LTD7
Top patents by PatentIndex Score
7 records- 0196US11837273B2Semiconductor device having interconnection in package and method for manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted Dec 5, 2023·2 cites·20 claims
- 0296US9805769B2Semiconductor device having interconnection in package and method for manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2015·Granted Oct 31, 2017·19 cites·7 claims
- 0393US10971208B2Semiconductor device having interconnection in package and method for manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2020·Granted Apr 6, 2021·3 cites·19 claims
- 0492US10734059B2Semiconductor device having interconnection in package and method for manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2019·Granted Aug 4, 2020·5 cites·20 claims
- 0575US10418087B2Semiconductor device having interconnection in package and method for manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2017·Granted Sep 17, 2019·1 cites·23 claims
- 0674US11417386B2Semiconductor device having interconnection in package and method for manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Aug 16, 2022·0 cites·20 claims
- 0764US11328760B2Semiconductor device having interconnection in package and method for manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2019·Granted May 10, 2022·0 cites·21 claims
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →