Inventor · disambiguated record
Ruoh-Huey Uang
Also filed as: UANG RUOH-HUEY
16 granted patents·7 pending applications·313 citations·filing 1998–2017
93Inventor score
Files withIND TECH RES INST11LEE CHANG YUNG CHEMICAL IND CORP5LEE TZONG-MING2UANG RUOH-HUEY2LCY CHEMICAL CORP1
Top patents by PatentIndex Score
23 records- 0194US6989325B2Self-assembled nanometer conductive bumps and method for fabricatingIND TECH RES INST·Filed 2003·Granted Jan 24, 2006·87 cites·6 claims
- 0287US6268114B1Method for forming fine-pitched solder bumpsIND TECH RES INST·Filed 1998·Granted Jul 31, 2001·97 cites·22 claims
- 0379US9856395B2Coating composition, method for coating a substrate using the same and pipelineLEE CHANG YUNG CHEMICAL IND CORPORATION·Filed 2015·Granted Jan 2, 2018·2 cites·25 claims
- 0472US6179200B1Method for forming solder bumps of improved height and devices formedIND TECH RES INST·Filed 1999·Granted Jan 30, 2001·35 cites·18 claims
- 0570US8426964B2Micro bump and method for forming the sameUANG RUOH-HUEY·Filed 2011·Granted Apr 23, 2013·3 cites·11 claims
- 0670US7605474B2Structure of polymer-matrix conductive film and method for fabricating the sameIND TECH RES INST·Filed 2006·Granted Oct 20, 2009·4 cites·6 claims
- 0766US7526861B2Method for fabricating structure of polymer-matrix conductive filmIND TECH RES INST·Filed 2006·Granted May 5, 2009·3 cites·23 claims
- 0865US6440836B1Method for forming solder bumps on flip chips and devices formedIND TECH RES INST·Filed 1999·Granted Aug 27, 2002·33 cites·19 claims
- 0964US7163885B2Method of migrating and fixing particles in a solution to bumps on a chipIND TECH RES INST·Filed 2004·Granted Jan 16, 2007·11 cites·26 claims
- 1064US6539624B1Method for forming wafer level packageIND TECH RES INST·Filed 1999·Granted Apr 1, 2003·31 cites·24 claims
- 1163US8802557B2Micro bump and method for forming the sameIND TECH RES INST·Filed 2013·Granted Aug 12, 2014·1 cites·11 claims
- 1262US8323553B2Method for manufacturing a substrate with surface structure by employing photothermal effectLEE TZONG-MING·Filed 2009·Granted Dec 4, 2012·3 cites·7 claims
- 1349US2010166976A1Method of manufacturing core-shell nanostructureIND TECH RES INST·Filed 2009·Application pending·0 cites
- 1446US7598609B2Structure of polymer-matrix conductive film and method for fabricating the sameIND TECH RES INST·Filed 2004·Granted Oct 6, 2009·3 cites·31 claims
- 1544US9617373B2Curable resin composition, article, and method for fabricating the sameLEE CHANG YUNG CHEMICAL IND CORP·Filed 2015·Granted Apr 11, 2017·0 cites·16 claims
- 1643US9616697B2Blanket for transferring a paste image from an engraved plate to a substrateLEE CHANG YUNG CHEMICAL IND CORP·Filed 2015·Granted Apr 11, 2017·0 cites·16 claims
- 1739US2012009353A1Method for manufacturing a substrate with surface structure by employing photothermal effectLEE TZONG-MING·Filed 2011·Application pending·0 cites
- 1839US2013087251A1Thermoelectric alloy material and thermoelectric elementLIU YION-NI·Filed 2012·Application pending·0 cites
- 1938US9573405B2Method and blanket for transferring a paste image from engraved plate to substrateLEE CHANG YUNG CHEMICAL IND CORP·Filed 2015·Granted Feb 21, 2017·0 cites·24 claims
- 2035US2017182830A1Blanket for transferring a paste image from engraved plate to substrateLCY CHEMICAL CORP·Filed 2017·Application pending·0 cites
- 2132US2016251515A1Curable resin composition, article, and method for fabricating the sameLEE CHANG YUNG CHEMICAL IND CORP·Filed 2015·Application pending·0 cites
- 2229US2012305298A1Bump with nanolaminated structure, package structure of the same, and method of preparing the sameUANG RUOH-HUEY·Filed 2011·Application pending·0 cites
- 2328US2016236499A1Blanket for transferring a paste image from engraved plate to substrateLEE CHANG YUNG CHEMICAL IND CORP·Filed 2015·Application pending·0 cites
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