Inventor · disambiguated record
Bernhard Rebhan
Also filed as: REBHAN BERNHARD
7 granted patents·21 citations·filing 2011–2015
78Inventor score
Top patents by PatentIndex Score
7 records- 0183US9640510B2Method for bonding metallic contact areas with solution of a sacrificial layer applied on one of the contact areasEV GROUP E THALLNER GMBH·Filed 2013·Granted May 2, 2017·9 cites·13 claims
- 0280US9067363B2Method and device for permanent bonding of wafers, as well as cutting toolMARTINSCHITZ KLAUS·Filed 2012·Granted Jun 30, 2015·6 cites·11 claims
- 0374US9947638B2Device and method for permanent bondingEV GROUP E THALLNER GMBH·Filed 2015·Granted Apr 17, 2018·2 cites·11 claims
- 0465US10163681B2Method for permanently bonding wafers by a connecting layer by means of solid state diffusion or phase transformationMARTINSCHITZ KLAUS·Filed 2011·Granted Dec 25, 2018·3 cites·26 claims
- 0556US9443820B2Device and method for bonding substratesREBHAN BERNHARD·Filed 2012·Granted Sep 13, 2016·1 cites·7 claims
- 0643US9358765B2Method for coating and bonding substratesEV GROUP E THALLNER GMBH·Filed 2012·Granted Jun 7, 2016·0 cites·18 claims
- 0737US9500541B2Method and device for determining the pressure distribution for bondingREBHAN BERNHARD·Filed 2011·Granted Nov 22, 2016·0 cites·13 claims
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