Inventor · disambiguated record
Laura M. Matz
Also filed as: MATZ LAURA · MATZ LAURA E · MATZ LAURA M
16 granted patents·15 pending applications·52 citations·filing 2004–2022
90Inventor score
Top patents by PatentIndex Score
31 records- 0188US7741224B2Plasma treatment and repair processes for reducing sidewall damage in low-k dielectricsTEXAS INSTRUMENTS INC·Filed 2007·Granted Jun 22, 2010·20 cites·39 claims
- 0286US8471049B2Precursors for depositing group 4 metal-containing filmsLEI XINJIAN·Filed 2009·Granted Jun 25, 2013·8 cites·18 claims
- 0379US11401441B2Chemical mechanical planarization (CMP) composition and methods therefore for copper and through silica via (TSV) applicationsVERSUM MAT US LLC·Filed 2018·Granted Aug 2, 2022·4 cites·2 claims
- 0476US8202808B2Methods of forming strontium titanate filmsMATZ LAURA M·Filed 2010·Granted Jun 19, 2012·3 cites·13 claims
- 0572US8753986B2Low k precursors providing superior integration attributesHAAS MARY KATHRYN·Filed 2010·Granted Jun 17, 2014·4 cites·21 claims
- 0671US8043976B2Adhesion to copper and copper electromigration resistanceAIR PROD & CHEM·Filed 2009·Granted Oct 25, 2011·3 cites·36 claims
- 0769US10072237B2Photoresist cleaning composition used in photolithography and a method for treating substrate therewithAIR PROD & CHEM·Filed 2016·Granted Sep 11, 2018·1 cites·20 claims
- 0869US8637396B2Dielectric barrier deposition using oxygen containing precursorMATZ LAURA M·Filed 2009·Granted Jan 28, 2014·3 cites·32 claims
- 0968US7745238B2Monitoring of temperature variation across wafers during processingTEXAS INSTRUMENTS INC·Filed 2008·Granted Jun 29, 2010·3 cites·22 claims
- 1065US9018107B2Low K precursors providing superior integration attributesAIR PROD & CHEM·Filed 2014·Granted Apr 28, 2015·1 cites·7 claims
- 1162US8889235B2Dielectric barrier deposition using nitrogen containing precursorMALLIKARJUNAN ANUPAMA·Filed 2010·Granted Nov 18, 2014·2 cites·7 claims
- 1251US2009081864A1SiC Film for Semiconductor ProcessingTEXAS INSTRUMENTS INC·Filed 2007·Application pending·0 cites
- 1351US2013059066A1Method of forming strontium titanate filmsINTERMOLECULAR INC·Filed 2012·Application pending·0 cites
- 1449US8592058B2Methods of forming strontium titanate filmsMATZ LAURA M·Filed 2010·Granted Nov 26, 2013·0 cites·2 claims
- 1548US7413994B2Hydrogen and oxygen based photoresist removal processTEXAS INSTRUMENTS INC·Filed 2005·Granted Aug 19, 2008·0 cites·40 claims
- 1647US2024184277A1Shared data induced quality control system for materialsVERSUM MAT US LLC·Filed 2022·Application pending·0 cites
- 1746US8507704B2Liquid composition containing aminoether for deposition of metal-containing filmsIVANOV SERGEI VLADIMIROVICH·Filed 2010·Granted Aug 13, 2013·0 cites·14 claims
- 1845US2009075480A1Silicon Carbide Doped Oxide Hardmask For Single and Dual Damascene IntegrationTEXAS INSTRUMENTS INC·Filed 2007·Application pending·0 cites
- 1945US2022332978A1Low Dishing Copper Chemical Mechanical PlanarizationVERSUM MAT US LLC·Filed 2020·Application pending·0 cites
- 2045US2011034023A1Silicon carbide film for integrated circuit fabricationTEXAS INSTRUMENTS INC·Filed 2010·Application pending·0 cites
- 2145US2006293181A1Thermal recording materials and methods of making and using the sameMENIZE ROBERT R·Filed 2006·Application pending·0 cites
- 2242US7682989B2Formation of a silicon oxide interface layer during silicon carbide etch stop deposition to promote better dielectric stack adhesionTEXAS INSTRUMENTS INC·Filed 2007·Granted Mar 23, 2010·0 cites·14 claims
- 2342US2008014739A1Silicon nitride/oxygen doped silicon carbide etch stop bi-layer for improved interconnect reliabilityTEXAS INSTRUMENTS INC·Filed 2006·Application pending·0 cites
- 2442US2007290347A1Semiconductive device having resist poison aluminum oxide barrier and method of manufactureTEXAS INSTRUMENTS INC·Filed 2006·Application pending·0 cites
- 2542US2008057701A1Method for prevention of resist poisoning in integrated circuit fabricationTEXAS INSTRUMENTS INC·Filed 2006·Application pending·0 cites
- 2641US8283260B2Process for restoring dielectric propertiesWEIGEL SCOTT JEFFREY·Filed 2009·Granted Oct 9, 2012·0 cites·8 claims
- 2740US2007184666A1Method for removing residue containing an embedded metalTEXAS INSTRUMENTS INC·Filed 2006·Application pending·0 cites
- 2840US2006264028A1Energy beam treatment to improve the hermeticity of a hermetic layerTEXAS INSTRUMENTS INC·Filed 2005·Application pending·0 cites
- 2940US2006264042A1Interconnect structure including a silicon oxycarbonitride layerTEXAS INSTRUMENTS INC·Filed 2005·Application pending·0 cites
- 3039US2006243792A1Stored-value card for variable printing and methods of using and making the sameMORELLO PETER S·Filed 2006·Application pending·0 cites
- 3137US2005241672A1Extraction of impurities in a semiconductor process with a supercritical fluidTEXAS INSTRUMENTS INC·Filed 2004·Application pending·0 cites
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