Inventor · disambiguated record
Cheng Kun Tsai
Also filed as: TSAI CHENG KUN
23 granted patents·291 citations·filing 2010–2020
95Inventor score
Files withTAIWAN SEMICONDUCTOR MFG CO LTD12TAIWAN SEMICONDUCTOR MFG4WANG HUNG-CHUN3CHIH MING-HUI2CHIANG CHIA-PING1
Top patents by PatentIndex Score
23 records- 0198US9390217B2Methodology of optical proximity correction optimizationTAIWAN SEMICONDUCTOR MFG·Filed 2013·Granted Jul 12, 2016·68 cites·20 claims
- 0297US8631360B2Methodology of optical proximity correction optimizationWANG HUNG-CHUN·Filed 2012·Granted Jan 14, 2014·34 cites·19 claims
- 0396US8627241B2Pattern correction with location effectWANG HUNG-CHUN·Filed 2012·Granted Jan 7, 2014·45 cites·18 claims
- 0496US8464186B2Providing electron beam proximity effect correction by simulating write operations of polygonal shapesWANG HUNG-CHUN·Filed 2011·Granted Jun 11, 2013·29 cites·20 claims
- 0592US10691864B2Method of post optical proximity correction (OPC) printing verification by machine learningTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Jun 23, 2020·9 cites·12 claims
- 0692US8527916B1Dissection splitting with optical proximity correction to reduce corner roundingCHIANG CHIA-PING·Filed 2012·Granted Sep 3, 2013·38 cites·18 claims
- 0791US8381153B2Dissection splitting with optical proximity correction and mask rule check enforcementTAIWAN SEMICONDUCTOR MFG·Filed 2010·Granted Feb 19, 2013·21 cites·20 claims
- 0890US8372742B2Method, system, and apparatus for adjusting local and global pattern density of an integrated circuit designTAIWAN SEMICONDUCTOR MFG·Filed 2010·Granted Feb 12, 2013·14 cites·18 claims
- 0989US8683392B2Double patterning methodologyHSIEH KEN-HSIEN·Filed 2011·Granted Mar 25, 2014·11 cites·17 claims
- 1088US9262578B2Method for integrated circuit manufacturingTAIWAN SEMICONDUCTOR MFG·Filed 2014·Granted Feb 16, 2016·9 cites·20 claims
- 1186US11048161B2Optical proximity correction methodology using pattern classification for target placementTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Jun 29, 2021·2 cites·20 claims
- 1282US11308256B2Method of post optical proximity correction (OPC) printing verification by machine learningTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Apr 19, 2022·1 cites·20 claims
- 1381US10520829B2Optical proximity correction methodology using underlying layer informationTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Dec 31, 2019·2 cites·20 claims
- 1479US10360339B2Method for integrated circuit manufacturingTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Jul 23, 2019·2 cites·20 claims
- 1576US9411924B2Methodology for pattern density optimizationTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2013·Granted Aug 9, 2016·3 cites·20 claims
- 1675US10049178B2Methodology for pattern density optimizationTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Aug 14, 2018·1 cites·20 claims
- 1770US9026955B1Methodology for pattern correctionTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2013·Granted May 5, 2015·2 cites·17 claims
- 1864US10860774B2Methodology for pattern density optimizationTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Dec 8, 2020·0 cites·20 claims
- 1962US10747938B2Method for integrated circuit manufacturingTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Aug 18, 2020·0 cites·20 claims
- 2059US10527928B2Optical proximity correction methodology using pattern classification for target placementTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Jan 7, 2020·0 cites·20 claims
- 2154US9418191B2Providing electron beam proximity effect correction by simulating write operations of polygonal shapesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2013·Granted Aug 16, 2016·0 cites·15 claims
- 2248US8499261B2Method and apparatus of patterning semiconductor deviceCHIH MING-HUI·Filed 2012·Granted Jul 30, 2013·0 cites·4 claims
- 2344US8196072B2Method and apparatus of patterning semiconductor deviceCHIH MING-HUI·Filed 2010·Granted Jun 5, 2012·0 cites·10 claims
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