Inventor · disambiguated record
Byoungok Lee
Also filed as: LEE BYOUNGOK
5 granted patents·7 pending applications·13 citations·filing 2006–2024
73Inventor score
Top patents by PatentIndex Score
12 records- 0187US10090279B2Stray inductance reduction in packaged semiconductor devices and modulesSEMICONDUCTOR COMPONENTS IND LLC·Filed 2017·Granted Oct 2, 2018·7 cites·20 claims
- 0283US11031379B2Stray inductance reduction in packaged semiconductor devicesSEMICONDUCTOR COMPONENTS IND LLC·Filed 2019·Granted Jun 8, 2021·4 cites·20 claims
- 0378US2024234246A1Integrated circuit direct cooling systems and related methodsSEMICONDUCTOR COMPONENTS IND LLC·Filed 2024·Application pending·0 cites
- 0477US10607919B2Semiconductor package having junction cooling pipes embedded in substratesSEMICONDUCTOR COMPONENTS IND LLC·Filed 2017·Granted Mar 31, 2020·2 cites·14 claims
- 0571US11967540B2Integrated circuit direct cooling systems having substrates in contact with a cooling mediumSEMICONDUCTOR COMPONENTS IND LLC·Filed 2021·Granted Apr 23, 2024·0 cites·18 claims
- 0670US2024186211A1Direct-cooling for semiconductor device modulesSEMICONDUCTOR COMPONENTS IND LLC·Filed 2024·Application pending·0 cites
- 0767US11201105B2Semiconductor package having a spacer with a junction cooling pipeSEMICONDUCTOR COMPONENTS IND LLC·Filed 2020·Granted Dec 14, 2021·0 cites·12 claims
- 0859US2025329610A1Fluid-cooled power moduleSEMICONDUCTOR COMPONENTS IND LLC·Filed 2024·Application pending·0 cites
- 0957US2022157688A1Direct-cooling for semiconductor device modulesSEMICONDUCTOR COMPONENTS IND LLC·Filed 2020·Application pending·0 cites
- 1056US2025105200A1Power module structure with clip substrate memberSEMICONDUCTOR COMPONENTS IND LLC·Filed 2023·Application pending·0 cites
- 1149US2024162110A1Semiconductor device package assemblies and methods of manufactureSEMICONDUCTOR COMPONENTS IND LLC·Filed 2022·Application pending·0 cites
- 1241US2008005417A1Method for speedy delivery of data between processors and digital processing apparatus having shared memoryMTEK VISION CO LTD·Filed 2006·Application pending·0 cites
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