Inventor · disambiguated record
Kenshi Kai
Also filed as: KAI KENSHI
11 granted patents·10 citations·filing 2014–2020
83Inventor score
Technology areasH10W
Files withFUJI ELECTRIC CO LTD11
Top patents by PatentIndex Score
11 records- 0175US10978371B2Semiconductor device and method for manufacturing semiconductor deviceFUJI ELECTRIC CO LTD·Filed 2019·Granted Apr 13, 2021·2 cites·20 claims
- 0275US10398036B2Semiconductor deviceFUJI ELECTRIC CO LTD·Filed 2018·Granted Aug 27, 2019·2 cites·15 claims
- 0371US9204559B2Manufacturing method of semiconductor device and mounting jigFUJI ELECTRIC CO LTD·Filed 2014·Granted Dec 1, 2015·3 cites·9 claims
- 0464US10405434B2Mounting jig for semiconductor deviceFUJI ELECTRIC CO LTD·Filed 2017·Granted Sep 3, 2019·1 cites·7 claims
- 0563US10199314B2Semiconductor device, metal member, and method of manufacturing semiconductor deviceFUJI ELECTRIC CO LTD·Filed 2016·Granted Feb 5, 2019·1 cites·19 claims
- 0662US9877397B2Mounting jig for semiconductor deviceFUJI ELECTRIC CO LTD·Filed 2015·Granted Jan 23, 2018·1 cites·8 claims
- 0756US11337306B2Semiconductor deviceFUJI ELECTRIC CO LTD·Filed 2020·Granted May 17, 2022·0 cites·12 claims
- 0856US11164846B2Semiconductor device manufacturing method and soldering support jigFUJI ELECTRIC CO LTD·Filed 2019·Granted Nov 2, 2021·0 cites·13 claims
- 0954US10566308B2Semiconductor device manufacturing method and soldering support jigFUJI ELECTRIC CO LTD·Filed 2018·Granted Feb 18, 2020·0 cites·7 claims
- 1042US11069643B2Semiconductor device manufacturing methodFUJI ELECTRIC CO LTD·Filed 2019·Granted Jul 20, 2021·0 cites·12 claims
- 1141US10699994B2Semiconductor device having bonding regions exposed through protective films provided on circuit patterns onto which components are solderedFUJI ELECTRIC CO LTD·Filed 2018·Granted Jun 30, 2020·0 cites·18 claims
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