Inventor · disambiguated record
David Auchere
Also filed as: AUCHERE DAVID
20 granted patents·7 pending applications·9 citations·filing 2014–2025
90Inventor score
Files withST MICROELECTRONICS GRENOBLE 217ST MICROELECTRONICS ALPS SAS4STMICROELECTRONICS (GRENOBLE 2) SAS4ST MICROELECTRONICS INT NV2
Top patents by PatentIndex Score
27 records- 0189US9754851B2Electronic device provided with an integrated conductor element and fabrication methodSTMICROELECTRONICS (GRENOBLE 2) SAS·Filed 2016·Granted Sep 5, 2017·5 cites·37 claims
- 0284US2025070081A1Method for forming an electrical connection between an electronic chip and a carrier substrate and electronic deviceST MICROELECTRONICS GRENOBLE 2·Filed 2024·Application pending·0 cites
- 0381US10116037B2Electronic device provided with an integrated conductor element and fabrication methodST MICROELECTRONICS ALPS SAS·Filed 2017·Granted Oct 30, 2018·2 cites·17 claims
- 0477US12170262B2Method for forming an electrical connection between an electronic chip and a carrier substrate and electronic deviceST MICROELECTRONICS GRENOBLE 2·Filed 2022·Granted Dec 17, 2024·0 cites·10 claims
- 0566US11557566B2Method for forming an electrical connection between an electronic chip and a carrier substrate and electronic deviceST MICROELECTRONICS GRENOBLE 2·Filed 2020·Granted Jan 17, 2023·0 cites·14 claims
- 0666US10879583B2Electronic device provided with an integrated conductor element and fabrication methodST MICROELECTRONICS ALPS SAS·Filed 2019·Granted Dec 29, 2020·0 cites·25 claims
- 0765US11756874B2Electronic device comprising a chip and at least one SMT electronic componentST MICROELECTRONICS GRENOBLE 2·Filed 2022·Granted Sep 12, 2023·0 cites·21 claims
- 0864US9754853B2Electronic device furnished with a conducting layer and method of fabricationSTMICROELECTRONICS (GRENOBLE 2) SAS·Filed 2016·Granted Sep 5, 2017·1 cites·19 claims
- 0963US9949381B2Electronic device with at least one impedance-compensating inductor and related methodsST MICROELECTRONICS GRENOBLE 2·Filed 2014·Granted Apr 17, 2018·1 cites·20 claims
- 1061US10643970B2Method for forming an electrical connection between an electronic chip and a carrier substrate and electronic deviceST MICROELECTRONICS GRENOBLE 2·Filed 2019·Granted May 5, 2020·0 cites·5 claims
- 1161US2025240871A1Device with laminated structure and method of manufacturing a laminated structure comprising dielectric layersST MICROELECTRONICS INT NV·Filed 2025·Application pending·0 cites
- 1260US12051681B2Voltage regulating deviceST MICROELECTRONICS GRENOBLE 2·Filed 2021·Granted Jul 30, 2024·0 cites·19 claims
- 1360US10522899B2Electronic device provided with an integrated conductor element and fabrication methodST MICROELECTRONICS GRENOBLE 2·Filed 2018·Granted Dec 31, 2019·0 cites·16 claims
- 1458US11482487B2Electronic device comprising a chip and at least one SMT electronic componentST MICROELECTRONICS GRENOBLE 2·Filed 2020·Granted Oct 25, 2022·0 cites·20 claims
- 1554US10224306B2Method for forming an electrical connection between an electronic chip and a carrier substrate and electronic deviceST MICROELECTRONICS GRENOBLE 2·Filed 2017·Granted Mar 5, 2019·0 cites·6 claims
- 1654US2024321809A1Electronic deviceST MICROELECTRONICS INT NV·Filed 2024·Application pending·0 cites
- 1752US10257943B2Electronic device with integrated circuit chip provided with an external electrical connection networkST MICROELECTRONICS GRENOBLE 2·Filed 2018·Granted Apr 9, 2019·0 cites·19 claims
- 1852US10062961B2Electronic device furnished with a conducting layer and method of fabricationST MICROELECTRONICS ALPS SAS·Filed 2017·Granted Aug 28, 2018·0 cites·12 claims
- 1951US10103079B2Electronic device provided with an integral conductive wire and method of manufactureST MICROELECTRONICS ALPS SAS·Filed 2017·Granted Oct 16, 2018·0 cites·12 claims
- 2051US2022301976A1Chip packaging device and corresponding manufacturing methodST MICROELECTRONICS GRENOBLE 2·Filed 2022·Application pending·0 cites
- 2148US9748159B2Electronic device provided with an integral conductive wire and method of manufactureSTMICROELECTRONICS (GRENOBLE 2) SAS·Filed 2016·Granted Aug 29, 2017·0 cites·29 claims
- 2248US2024038607A1Integrated circuit packageST MICROELECTRONICS GRENOBLE 2·Filed 2023·Application pending·0 cites
- 2347US9402331B2Integrated circuit chip comprising electronic device and electronic systemSTMICROELECTRONICS (GRENOBLE 2) SAS·Filed 2014·Granted Jul 26, 2016·0 cites·18 claims
- 2443US10897822B2Electronic device comprising an electronic component mounted on a support substrate and assembly methodST MICROELECTRONICS GRENOBLE 2·Filed 2020·Granted Jan 19, 2021·0 cites·14 claims
- 2541US10811349B2Electronic device including at least one electronic chip and electronic packageST MICROELECTRONICS GRENOBLE 2·Filed 2018·Granted Oct 20, 2020·0 cites·19 claims
- 2640US2019214274A1Insulating contacting spacerST MICROELECTRONICS GRENOBLE 2·Filed 2019·Application pending·0 cites
- 2738US2020196433A1Method for mounting componentST MICROELECTRONICS GRENOBLE 2·Filed 2019·Application pending·0 cites
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →