Inventor · disambiguated record
Jonathan Almeria Noquil
Also filed as: NOQUIL JONATHAN · NOQUIL JONATHAN A · NOQUIL JONATHAN ALMERIA
66 granted patents·12 pending applications·728 citations·filing 2001–2024
99Inventor score
Files withTEXAS INSTRUMENTS INC54FAIRCHILD SEMICONDUCTOR11HERBSOMMER JUAN A6NOQUIL JONATHAN A3CICLON SEMICONDUCTOR DEVICE CORP1
Top patents by PatentIndex Score
78 records- 0198US9214415B2Integrating multi-output power converters having vertically stacked semiconductor chipsTEXAS INSTRUMENTS INC·Filed 2014·Granted Dec 15, 2015·41 cites·16 claims
- 0297US9373571B2Integrating multi-output power converters having vertically stacked semiconductor chipsTEXAS INSTRUMENTS INC·Filed 2015·Granted Jun 21, 2016·19 cites·9 claims
- 0397US7157799B2Semiconductor die package including carrier with mask and semiconductor dieFAIRCHILD SEMICONDUCTOR·Filed 2003·Granted Jan 2, 2007·131 cites·13 claims
- 0497US6645791B2Semiconductor die package including carrier with maskFAIRCHILD SEMICONDUCTOR·Filed 2001·Granted Nov 11, 2003·128 cites·18 claims
- 0596US12015019B2Stacked die multichip module packageTEXAS INSTRUMENTS INC·Filed 2021·Granted Jun 18, 2024·3 cites·20 claims
- 0696US7256479B2Method to manufacture a universal footprint for a package with exposed chipFAIRCHILD SEMICONDUCTOR·Filed 2005·Granted Aug 14, 2007·62 cites·17 claims
- 0795US7663211B2Dual side cooling integrated power device package and module with a clip attached to a leadframe in the package and the module and methods of manufactureFAIRCHILD SEMICONDUCTOR·Filed 2007·Granted Feb 16, 2010·40 cites·20 claims
- 0894US7777315B2Dual side cooling integrated power device module and methods of manufactureFAIRCHILD SEMICONDUCTOR·Filed 2007·Granted Aug 17, 2010·29 cites·16 claims
- 0993US11081472B2Stacked die multichip module packageTEXAS INSTRUMENTS INC·Filed 2019·Granted Aug 3, 2021·8 cites·20 claims
- 1093US8910369B2Fabricating a power supply converter with load inductor structured as heat sinkTEXAS INSTRUMENTS INC·Filed 2014·Granted Dec 16, 2014·16 cites·2 claims
- 1192US11784114B2Plated metal layer in power packagesTEXAS INSTRUMENTS INC·Filed 2021·Granted Oct 10, 2023·2 cites·20 claims
- 1291US8431979B2Power converter having integrated capacitorHERBSOMMER JUAN A·Filed 2011·Granted Apr 30, 2013·14 cites·18 claims
- 1390US9935041B1Multi-chip module clips with connector barTEXAS INSTRUMENTS INC·Filed 2017·Granted Apr 3, 2018·7 cites·11 claims
- 1490US8049312B2Semiconductor device package and method of assembly thereofCICLON SEMICONDUCTOR DEVICE CORP·Filed 2009·Granted Nov 1, 2011·24 cites·5 claims
- 1589US11177197B2Semiconductor package with solder standoffTEXAS INSTRUMENTS INC·Filed 2019·Granted Nov 16, 2021·5 cites·24 claims
- 1688US7154186B2Multi-flip chip on lead frame on over molded IC package and method of assemblyFAIRCHILD SEMICONDUCTOR·Filed 2004·Granted Dec 26, 2006·42 cites·13 claims
- 1787US8546925B2Synchronous buck converter having coplanar array of contact bumps of equal volumeHERBSOMMER JUAN A·Filed 2011·Granted Oct 1, 2013·10 cites·15 claims
- 1887US7439613B2Substrate based unmolded packageFAIRCHILD SEMICONDCUTOR CORP·Filed 2004·Granted Oct 21, 2008·36 cites·15 claims
- 1985US9305852B1Silicon package for embedded electronic system having stacked semiconductor chipsTEXAS INSTRUMENTS INC·Filed 2014·Granted Apr 5, 2016·6 cites·13 claims
- 2084US10050025B2Power converter monolithically integrating transistors, carrier, and componentsTEXAS INSTRUMENTS INC·Filed 2016·Granted Aug 14, 2018·4 cites·10 claims
- 2183US9305872B2DC-DC converter having terminals of semiconductor chips directly attachable to circuit boardTEXAS INSTRUMENTS INC·Filed 2015·Granted Apr 5, 2016·3 cites·8 claims
- 2282US8354303B2Thermally enhanced low parasitic power semiconductor packageTEXAS INSTRUMENTS INC·Filed 2009·Granted Jan 15, 2013·8 cites·12 claims
- 2382US7335532B2Method of assembly for multi-flip chip on lead frame on overmolded IC packageFAIRCHILD SEMICONDUCTOR·Filed 2006·Granted Feb 26, 2008·9 cites·2 claims
- 2481US11658130B2Conductive plate stress reduction featureTEXAS INSTRUMENTS INC·Filed 2020·Granted May 23, 2023·1 cites·30 claims
- 2580US9508633B2High performance power transistor having ultra-thin packageHERBSOMMER JUAN A·Filed 2011·Granted Nov 29, 2016·5 cites·10 claims
- 2679US9543240B2DC-DC converter having terminals of semiconductor chips directly attachable to circuit boardTEXAS INSTRUMENTS INC·Filed 2016·Granted Jan 10, 2017·2 cites·8 claims
- 2778US12406915B2Plated metal layer in power packagesTEXAS INSTRUMENTS INC·Filed 2023·Granted Sep 2, 2025·0 cites·23 claims
- 2878US7492043B2Power module flip chip packageFAIRCHILD KR SEMICONDUCTOR LTD·Filed 2004·Granted Feb 17, 2009·27 cites·10 claims
- 2977US8760872B2DC-DC converter vertically integrated with load inductor structured as heat sinkHERBSOMMER JUAN A·Filed 2011·Granted Jun 24, 2014·3 cites·3 claims
- 3076US9425132B2Stacked synchronous buck converter having chip embedded in outside recess of leadframeTEXAS INSTRUMENTS INC·Filed 2015·Granted Aug 23, 2016·2 cites·10 claims
- 3175US12243809B2Packaged electronic device with film isolated power stackTEXAS INSTRUMENTS INC·Filed 2023·Granted Mar 4, 2025·0 cites·17 claims
- 3274US9171828B2DC-DC converter having terminals of semiconductor chips directly attachable to circuit boardTEXAS INSTRUMENTS INC·Filed 2014·Granted Oct 27, 2015·2 cites·4 claims
- 3374US7501702B2Integrated transistor module and method of fabricating sameFAIRCHILD SEMICONDUCTOR·Filed 2004·Granted Mar 10, 2009·17 cites·18 claims
- 3473US10438936B2Photo-sensitive silicon package embedding self-powered electronic systemTEXAS INSTRUMENTS INC·Filed 2017·Granted Oct 8, 2019·1 cites·5 claims
- 3573US7682877B2Substrate based unmolded packageFAIRCHILD SEMICONDUCTOR·Filed 2008·Granted Mar 23, 2010·3 cites·14 claims
- 3671US9721860B2Silicon package for embedded semiconductor chip and power converterTEXAS INSTRUMENTS INC·Filed 2014·Granted Aug 1, 2017·2 cites·9 claims
- 3771US7812437B2Flip chip MLP with folded heat sinkFAIRCHILD SEMICONDUCTOR·Filed 2007·Granted Oct 12, 2010·6 cites·10 claims
- 3870US10826487B2Power unit with an integrated pull-down transistorTEXAS INSTRUMENTS INC·Filed 2017·Granted Nov 3, 2020·2 cites·15 claims
- 3969US11908780B2Semiconductor package with solder standoffTEXAS INSTRUMENTS INC·Filed 2021·Granted Feb 20, 2024·0 cites·24 claims
- 4069US10062624B2Silicon package for embedded semiconductor chip and power converterTEXAS INSTRUMENTS INC·Filed 2017·Granted Aug 28, 2018·1 cites·8 claims
- 4168US11640932B2Packaged electronic device with film isolated power stackTEXAS INSTRUMENTS INC·Filed 2021·Granted May 2, 2023·0 cites·20 claims
- 4266US11930590B2Stress relief for flip-chip packaged devicesTEXAS INSTRUMENTS INC·Filed 2021·Granted Mar 12, 2024·0 cites·12 claims
- 4366US9779967B2Ultra-thin power transistor and synchronous buck converter having customized footprintTEXAS INSTRUMENTS INC·Filed 2015·Granted Oct 3, 2017·1 cites·11 claims
- 4463US9165865B2Ultra-thin power transistor and synchronous buck converter having customized footprintHERBSOMMER JUAN A·Filed 2011·Granted Oct 20, 2015·1 cites·10 claims
- 4563US9076891B2Integrated circuit (“IC”) assembly includes an IC die with a top metallization layer and a conductive epoxy layer applied to the top metallization layerTEXAS INSTRUMENTS INC·Filed 2013·Granted Jul 7, 2015·1 cites·20 claims
- 4662US11177246B2Photo-sensitive silicon package embedding self-powered electronic systemTEXAS INSTRUMENTS INC·Filed 2019·Granted Nov 16, 2021·0 cites·22 claims
- 4762US10396016B2Leadframe inductorTEXAS INSTRUMENTS INC·Filed 2016·Granted Aug 27, 2019·1 cites·19 claims
- 4860US7842555B2Integrated transistor module and method of fabricating sameFAIRCHILD SEMICONDUCTOR·Filed 2009·Granted Nov 30, 2010·1 cites·7 claims
- 4959US11024564B2Packaged electronic device with film isolated power stackTEXAS INSTRUMENTS INC·Filed 2019·Granted Jun 1, 2021·0 cites·20 claims
- 5058US8119457B2Flip chip MLP with folded heat sinkNOQUIL JONATHAN A·Filed 2010·Granted Feb 21, 2012·1 cites·14 claims
Showing the top 50 of 78 patent records by PatentIndex Score.
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