Inventor · disambiguated record
Shoji Minegishi
Also filed as: MINEGISHI SHOJI
9 granted patents·4 pending applications·14 citations·filing 2003–2015
81Inventor score
Top patents by PatentIndex Score
13 records- 0177US9188871B2Pattern forming method, alkali-developable thermosetting resin composition, printed circuit board and manufacturing method thereofTAIYO INK MFG CO LTD·Filed 2013·Granted Nov 17, 2015·3 cites·17 claims
- 0270US9497856B2Laminated structure, dry film and method of producing laminated structureTAIYO INK MFG CO LTD·Filed 2013·Granted Nov 15, 2016·1 cites·17 claims
- 0369US9596754B2Dry film, printed wiring board using same, method for producing printed wiring board, and flip chip mounting substrateTAIYO INK MFG CO LTD·Filed 2012·Granted Mar 14, 2017·4 cites·20 claims
- 0468US9388308B2Curable resin composition, composition for forming solder resist, dry film and printed wiring board, and laminate and process for preparing the sameTAIYO INK MFG CO LTD·Filed 2013·Granted Jul 12, 2016·1 cites·20 claims
- 0568US8765831B2Photocurable resin compositionMINEGISHI SHOJI·Filed 2010·Granted Jul 1, 2014·2 cites·20 claims
- 0666US7718714B2Resin curable with actinic energy ray, photocurable and thermosetting resin composition containing the same, and cured product obtained therefromTAIYO INK MFG CO LTD·Filed 2006·Granted May 18, 2010·1 cites·20 claims
- 0764US9265156B2Curable composition, cured coating film prepared from curable composition, and printed wiring board including the cured filmTAIYO INK MFG CO LTD·Filed 2014·Granted Feb 16, 2016·1 cites·20 claims
- 0858US9298096B2Curable resin composition, cured product thereof, printed circuit board comprising the same, and method for producing the cured productTAIYO INK MFG CO LTD·Filed 2014·Granted Mar 29, 2016·1 cites·13 claims
- 0938US9891523B2Photosensitive dry film and process for producing printed wiring board using the sameTAIYO INK MFG CO LTD·Filed 2015·Granted Feb 13, 2018·0 cites·18 claims
- 1038US2014374143A1Dry film, layered structure, printed wiring board, and process for producing layered structureTAIYO INK MFG CO LTD·Filed 2012·Application pending·0 cites
- 1133US2017048974A1Resin composition for permanent insulating film, permanent insulating film, multilayer printed wiring board, and process for producing the sameTAIYO INK MFG CO LTD·Filed 2015·Application pending·0 cites
- 1233US2013260109A1Photocurable resin composition, dry film, cured product and printed wiring boardTAIYO INK MFG CO LTD·Filed 2013·Application pending·0 cites
- 1330US2004067440A1Actinic energy ray-curable resin, photocurable and thermosetting resin composition containing the same, and cured products thereofFiled 2003·Application pending·0 cites
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