Inventor · disambiguated record
In-Kyum Lee
Also filed as: LEE IN-KYUM
2 granted patents·8 citations·filing 2014–2014
52Inventor score
Technology areasH10W
Top patents by PatentIndex Score
2 records- 0177US9087885B2Method of fabricating semiconductor devices having through-silicon via (TSV) structuresSAMSUNG ELECTRONICS CO LTD·Filed 2014·Granted Jul 21, 2015·6 cites·16 claims
- 0256US9437554B2Semiconductor package having magnetic substance and related equipmentJI SANG-WOOK·Filed 2014·Granted Sep 6, 2016·2 cites·14 claims
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →