Inventor · disambiguated record
Milind Shah
Also filed as: SHAH MILIND · SHAH MILIND P · SHAH MILIND PRAVIN
44 granted patents·12 pending applications·427 citations·filing 2003–2023
97Inventor score
Top patents by PatentIndex Score
56 records- 0197US9379090B1System, apparatus, and method for split die interconnectionQUALCOMM INC·Filed 2015·Granted Jun 28, 2016·43 cites·27 claims
- 0296US6996892B1Circuit board embedded inductorRF MICRO DEVICES INC·Filed 2005·Granted Feb 14, 2006·103 cites·18 claims
- 0395US10510733B2Integrated device comprising embedded package on package (PoP) deviceQUALCOMM INC·Filed 2018·Granted Dec 17, 2019·11 cites·24 claims
- 0494US11670614B2Integrated circuit assembly with hybrid bondingQUALCOMM INC·Filed 2020·Granted Jun 6, 2023·3 cites·20 claims
- 0594US7451539B2Method of making a conformal electromagnetic interference shieldRF MICRO DEVICES INC·Filed 2005·Granted Nov 18, 2008·89 cites·24 claims
- 0693US8434220B2Heat sink formed with conformal shieldRAO JAYANTI JAGANATHA·Filed 2007·Granted May 7, 2013·27 cites·22 claims
- 0792US11239573B2Sub-module L-shaped millimeter wave antenna-in-packageQUALCOMM INC·Filed 2020·Granted Feb 1, 2022·3 cites·17 claims
- 0891US11652101B2Trench capacitor assembly for high capacitance densityQUALCOMM INC·Filed 2021·Granted May 16, 2023·2 cites·12 claims
- 0991US9806063B2Reinforced wafer level package comprising a core layer for reducing stress in a solder joint and improving solder joint reliabilityQUALCOMM INC·Filed 2015·Granted Oct 31, 2017·9 cites·23 claims
- 1091US8296941B2Conformal shielding employing segment buildupHINER DAVID J·Filed 2011·Granted Oct 30, 2012·10 cites·16 claims
- 1188US8062930B1Sub-module conformal electromagnetic interference shieldSHAH MILIND·Filed 2006·Granted Nov 22, 2011·39 cites·33 claims
- 1287US9484327B2Package-on-package structure with reduced heightQUALCOMM INC·Filed 2013·Granted Nov 1, 2016·10 cites·10 claims
- 1386US11417637B2Stacked decoupling capacitors with integration in a substrateQUALCOMM INC·Filed 2020·Granted Aug 16, 2022·2 cites·20 claims
- 1486US11201127B2Device comprising contact to contact coupling of packagesQUALCOMM INC·Filed 2020·Granted Dec 14, 2021·2 cites·39 claims
- 1586US11101228B1Integrated circuit package with a magnetic coreQUALCOMM INC·Filed 2020·Granted Aug 24, 2021·2 cites·20 claims
- 1686US9137934B2Compartmentalized shielding of selected componentsMORRIS THOMAS SCOTT·Filed 2011·Granted Sep 15, 2015·11 cites·17 claims
- 1778US9131634B2Radio frequency package on package circuitQUALCOMM INC·Filed 2012·Granted Sep 8, 2015·5 cites·53 claims
- 1878US8093982B2Three dimensional inductor and transformer design methodology of glass technologyKIM JONGHAE·Filed 2010·Granted Jan 10, 2012·5 cites·23 claims
- 1978US7474189B1Circuit board embedded inductorRF MICRO DEVICES INC·Filed 2005·Granted Jan 6, 2009·7 cites·6 claims
- 2077US9269681B2Surface finish on trace for a thermal compression flip chip (TCFC)QUALCOMM INC·Filed 2013·Granted Feb 23, 2016·4 cites·7 claims
- 2175US11894366B2Trench capacitor assembly for high capacitance densityQUALCOMM INC·Filed 2023·Granted Feb 6, 2024·0 cites·8 claims
- 2275US7999197B1Dual sided electronic moduleRF MICRO DEVICES INC·Filed 2009·Granted Aug 16, 2011·7 cites·21 claims
- 2374US8633597B2Thermal vias in an integrated circuit package with an embedded dieSWEENEY FIFIN·Filed 2010·Granted Jan 21, 2014·4 cites·29 claims
- 2474US7732253B1Flip-chip assembly with improved interconnectRF MICRO DEVICES INC·Filed 2006·Granted Jun 8, 2010·8 cites·20 claims
- 2573US12300655B2Integrated circuit assembly with hybrid bondingQUALCOMM INC·Filed 2023·Granted May 13, 2025·0 cites·22 claims
- 2673US9466578B2Substrate comprising improved via pad placement in bump areaQUALCOMM INC·Filed 2014·Granted Oct 11, 2016·3 cites·28 claims
- 2771US9601435B2Semiconductor package with embedded components and method of making the sameQUALCOMM INC·Filed 2015·Granted Mar 21, 2017·2 cites·14 claims
- 2870US8802556B2Barrier layer on bump and non-wettable coating on traceQUALCOMM INC·Filed 2013·Granted Aug 12, 2014·2 cites·20 claims
- 2969US11764489B2Sub-module L-shaped millimeter wave antenna-in-packageQUALCOMM INC·Filed 2022·Granted Sep 19, 2023·0 cites·20 claims
- 3069US8847375B2Microelectromechanical systems embedded in a substrateSHAH MILIND P·Filed 2010·Granted Sep 30, 2014·4 cites·15 claims
- 3159US6884661B1Method of fabricating posts over integrated heat sink metallization to enable flip chip packaging of GaAs devicesRF MICRO DEVICES INC·Filed 2003·Granted Apr 26, 2005·8 cites·17 claims
- 3257US11776888B2Package with a substrate comprising protruding pad interconnectsQUALCOMM INC·Filed 2021·Granted Oct 3, 2023·0 cites·34 claims
- 3356US8742603B2Process for improving package warpage and connection reliability through use of a backside mold configuration (BSMC)BCHIR OMAR J·Filed 2010·Granted Jun 3, 2014·1 cites·13 claims
- 3454US11296670B2Impedance matching transceiverQUALCOMM INC·Filed 2020·Granted Apr 5, 2022·0 cites·20 claims
- 3554US11189686B2Integrated device coupled to a capacitor structure comprising a trench capacitorQUALCOMM INC·Filed 2020·Granted Nov 30, 2021·0 cites·30 claims
- 3653US8415567B1Forming soldering surfaces without requiring a solder maskSAWYER BRIAN D·Filed 2010·Granted Apr 9, 2013·1 cites·20 claims
- 3752US11817379B2Substrate comprising an inductor and a capacitor located in an encapsulation layerQUALCOMM INC·Filed 2020·Granted Nov 14, 2023·0 cites·28 claims
- 3852US2014322868A1Barrier layer on bump and non-wettable coating on traceQUALCOMM INC·Filed 2014·Application pending·0 cites
- 3951US12046545B2Hybrid reconstituted substrate for electronic packagingQUALCOMM INC·Filed 2020·Granted Jul 23, 2024·0 cites·16 claims
- 4051US11320847B2Voltage regulation integrated circuit (IC) with circuit components in an integrated three-dimensional (3D) inductor core and related methods of fabricationQUALCOMM INC·Filed 2020·Granted May 3, 2022·0 cites·21 claims
- 4151US2010199492A1Conformal shielding employing segment buildupRF MICRO DEVICES INC·Filed 2010·Application pending·0 cites
- 4249US10163871B2Integrated device comprising embedded package on package (PoP) deviceQUALCOMM INC·Filed 2016·Granted Dec 25, 2018·0 cites·33 claims
- 4349US2023369234A1Package comprising a substrate and an interconnection die configured for high density interconnectionQUALCOMM INC·Filed 2022·Application pending·0 cites
- 4448US11689181B2Package comprising stacked filters with a shared substrate capQUALCOMM INC·Filed 2020·Granted Jun 27, 2023·0 cites·17 claims
- 4547US2015221528A9Process for improving package warpage and connection reliability through use of a backside mold configuration (bsmc)QUALCOMM INC·Filed 2014·Application pending·0 cites
- 4645US2021281234A1Hybrid three dimensional inductorQUALCOMM INC·Filed 2020·Application pending·0 cites
- 4744US2015206812A1Substrate and method of forming the sameQUALCOMM INC·Filed 2014·Application pending·0 cites
- 4843US8703602B2Selective seed layer treatment for feature platingBCHIR OMAR J·Filed 2010·Granted Apr 22, 2014·0 cites·11 claims
- 4942US2021280507A1Package comprising dummy interconnectsQUALCOMM INC·Filed 2020·Application pending·0 cites
- 5042US2014175658A1Anchoring a trace on a substrate to reduce peeling of the traceQUALCOMM INC·Filed 2013·Application pending·0 cites
Showing the top 50 of 56 patent records by PatentIndex Score.
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