Inventor · disambiguated record
Kyung-Mun Byun
Also filed as: BYUN KYUNG-MUN
7 granted patents·2 pending applications·27 citations·filing 2008–2017
79Inventor score
Top patents by PatentIndex Score
9 records- 0187US10141200B2Methods of manufacturing semiconductor devicesSAMSUNG ELECTRONICS CO LTD·Filed 2017·Granted Nov 27, 2018·12 cites·20 claims
- 0287US9391138B2Semiconductor devices including empty spaces and methods of forming the sameSAMSUNG ELECTRONICS CO LTD·Filed 2014·Granted Jul 12, 2016·8 cites·19 claims
- 0367US7858492B2Method of filling a trench and method of forming an isolating layer structure using the sameSAMSUNG ELECTRONICS CO LTD·Filed 2008·Granted Dec 28, 2010·4 cites·20 claims
- 0463US8624354B2Semiconductor devices including 3-D structures with support pad structures and related methods and systemsKIM SHIN-HYE·Filed 2010·Granted Jan 7, 2014·3 cites·23 claims
- 0549US9953928B2Semiconductor devices including empty spacesSAMSUNG ELECTRONICS CO LTD·Filed 2016·Granted Apr 24, 2018·0 cites·16 claims
- 0645US7781304B2Semiconductor device having trench isolation region and methods of fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2008·Granted Aug 24, 2010·0 cites·23 claims
- 0744US2009045483A1Semiconductor devices having trench isolation regions and methods of manufacturing semiconductor devices having trench isolation regionsSAMSUNG ELECTRONICS CO LTD·Filed 2008·Application pending·0 cites
- 0835US2010240194A1Method of fabricating semiconductor deviceJUNG DEOKYOUNG·Filed 2010·Application pending·0 cites
- 0934US8697583B2Oxidation-promoting compositions, methods of forming oxide layers, and methods of fabricating semiconductor devicesOH KYUNG-SEOK·Filed 2011·Granted Apr 15, 2014·0 cites·20 claims
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