Inventor · disambiguated record
Ming-Chi Kan
Also filed as: KAN MING CHI
4 granted patents·7 pending applications·16 citations·filing 2005–2012
69Inventor score
Top patents by PatentIndex Score
11 records- 0177US7727798B1Method for production of diamond-like carbon film having semiconducting propertyNAT TAIPEI UNIVERSITY TECHNOLO·Filed 2009·Granted Jun 1, 2010·11 cites·14 claims
- 0265US9006086B2Stress regulated semiconductor devices and associated methodsSUNG CHIEN-MIN·Filed 2012·Granted Apr 14, 2015·2 cites·17 claims
- 0365US8778784B2Stress regulated semiconductor devices and associated methodsSUNG CHIEN-MIN·Filed 2011·Granted Jul 15, 2014·2 cites·17 claims
- 0454US2009266599A1Circuit board with high thermal conductivity and method for manufacturing the sameKINIK CO·Filed 2008·Application pending·0 cites
- 0550US7867892B2Packaging carrier with high heat dissipation and method for manufacturing the sameKINIK CO·Filed 2008·Granted Jan 11, 2011·1 cites·13 claims
- 0650US2011011628A1Highly thermal conductive circuit boardKINIK CO·Filed 2009·Application pending·0 cites
- 0742US2009250248A1Support substrate structure for supporting electronic component thereon and method for fabricating the sameKINIK CO·Filed 2008·Application pending·0 cites
- 0839US2007035930A1Methods and devices for cooling printed circuit boardsSUNG CHIEN-MIN·Filed 2005·Application pending·0 cites
- 0937US2008144291A1Methods and devices for cooling printed circuit boardsHU SHAO CHUNG·Filed 2006·Application pending·0 cites
- 1035US2011127562A1Electronic Substrate Having Low Current Leakage and High Thermal Conductivity and Associated MethodsSUNG CHIEN-MIN·Filed 2010·Application pending·0 cites
- 1134US2011232950A1Substrate and method for manufacturing the sameHU SHAO-CHUNG·Filed 2010·Application pending·0 cites
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