Inventor · disambiguated record
Max John Christopher Koschmeder
Also filed as: KOSCHMEDER MAX J · KOSCHMEDER MAX J C · KOSCHMEDER MAX JOHN CHRISTOPHE · KOSCHMEDER MAX JOHN-CHRISTOPHER
10 granted patents·164 citations·filing 1998–2011
90Inventor score
Top patents by PatentIndex Score
10 records- 0193US7327577B2Method and apparatus for grounding a heat sink in thermal contact with an electronic component using a grounding spring having multiple-jointed spring fingersIBM·Filed 2005·Granted Feb 5, 2008·23 cites·5 claims
- 0287US7573709B2Grounding a heat sink in thermal contact with an electronic component using a grounding spring having multiple-jointed spring fingersIBM·Filed 2008·Granted Aug 11, 2009·12 cites·15 claims
- 0384US7564690B2Method for grounding a heat sink in thermal contact with an electronic component using a grounding spring having multiple-jointed spring fingersIBM·Filed 2007·Granted Jul 21, 2009·10 cites·4 claims
- 0483US8186174B2Temperature control system for an electronic device cabinetGILLILAND DON A·Filed 2009·Granted May 29, 2012·11 cites·15 claims
- 0583US6335868B1Enhanced enclosure arrangement for a computerIBM·Filed 2000·Granted Jan 1, 2002·41 cites·29 claims
- 0680US6818822B1Conductive gasket including internal contact-enhancing stripIBM·Filed 2004·Granted Nov 16, 2004·24 cites·20 claims
- 0777US6267614B1Low profile/high leverage electronic computer book latching systemIBM·Filed 2000·Granted Jul 31, 2001·27 cites·9 claims
- 0863US8763913B2RFID tag integrated into an enclosure surface doorALO ROLAND K·Filed 2011·Granted Jul 1, 2014·3 cites·8 claims
- 0949US7485813B1Stacked hole formed patterns for shielding through an apertureIBM·Filed 2008·Granted Feb 3, 2009·0 cites·1 claims
- 1049US6109930AEnhanced hardware arrangement for mounting a plurality of circuit boards togetherIBM·Filed 1998·Granted Aug 29, 2000·13 cites·31 claims
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