Inventor · disambiguated record
Ki Sung Jung
Also filed as: JUNG KI S · JUNG KI SUNG
6 granted patents·3 pending applications·190 citations·filing 1999–2015
84Inventor score
Top patents by PatentIndex Score
9 records- 0187US6621807B1Device and method for transmitting common channel message in CDMA communication systemSAMSUNG ELECTRONICS CO LTD·Filed 1999·Granted Sep 16, 2003·76 cites·24 claims
- 0280US6770685B1Resin composition for manufacturing optical fiber ribbon and method for preparing resin for manufacturing optical fiber ribbon using the sameSSCP CO LTD·Filed 2000·Granted Aug 3, 2004·24 cites·16 claims
- 0378US7863758B2Adhesive film composition, associated dicing die bonding film, and die packageCHEIL IND INC·Filed 2007·Granted Jan 4, 2011·11 cites·20 claims
- 0470US6845089B1Method of continuously transmitting user data on a reverse common channel in a mobile communication systemSAMSUNG ELECTRONICS CO LTD·Filed 1999·Granted Jan 18, 2005·76 cites·23 claims
- 0562US8394493B2Bonding film composition for semiconductor assembly, bonding film therefrom, and dicing die bond film comprising the sameHONG YONG WOO·Filed 2007·Granted Mar 12, 2013·1 cites·10 claims
- 0661US7700007B2Anisotropic conductive film forming compositionCHEIL IND INC·Filed 2005·Granted Apr 20, 2010·2 cites·33 claims
- 0747US2013052900A1Environmentally friendly coated yarn and coating composition thereforJUNG KI SUNG·Filed 2011·Application pending·0 cites
- 0842US2017039589A1Operation method and system for point enhancement service, and computer-readable recording medium in which operation method is recordedJUNG KI SUNG·Filed 2015·Application pending·0 cites
- 0937US2008063871A1Adhesive film composition for semiconductor assembly, associated dicing die bonding film and semiconductor packageJUNG KI S·Filed 2007·Application pending·0 cites
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