Inventor · disambiguated record
Kurt Raab
Also filed as: RAAB KURT · RAAB KURT R · RAAB KURT RAYMOND
13 granted patents·714 citations·filing 1989–2013
94Inventor score
Top patents by PatentIndex Score
13 records- 0195US5108553AG-tab manufacturing process and the product produced therebyOLIN CORP·Filed 1989·Granted Apr 28, 1992·213 cites·49 claims
- 0291US5801432AElectronic system using multi-layer tab tape semiconductor device having distinct signal, power and ground planesLSI LOGIC CORP·Filed 1996·Granted Sep 1, 1998·139 cites·27 claims
- 0388US6049972AUniversal unit strip/carrier frame assembly and methodsTESSERA INC·Filed 1998·Granted Apr 18, 2000·81 cites·35 claims
- 0487US6686015B2Transferable resilient element for packaging of a semiconductor chip and method thereforTESSERA INC·Filed 2001·Granted Feb 3, 2004·49 cites·23 claims
- 0586US5915170AMultiple part compliant interface for packaging of a semiconductor chip and method thereforTESSERA INC·Filed 1997·Granted Jun 22, 1999·91 cites·34 claims
- 0672US6294040B1Transferable resilient element for packaging of a semiconductor chip and method thereforTESSERA INC·Filed 1997·Granted Sep 25, 2001·42 cites·26 claims
- 0762US5065228AG-TAB having particular through holeOLIN CORP·Filed 1989·Granted Nov 12, 1991·29 cites·11 claims
- 0860US6309910B1Microelectronic components with frangible lead sectionsTESSERA INC·Filed 1999·Granted Oct 30, 2001·24 cites·31 claims
- 0958US6687980B1Apparatus for processing flexible tape for microelectronic assembliesTESSERA INC·Filed 2000·Granted Feb 10, 2004·6 cites·16 claims
- 1057US5854085AMulti-layer tab tape having distinct signal, power and ground planes, semiconductor device assembly employing same, apparatus for and method of assembling sameLSI LOGIC CORP·Filed 1996·Granted Dec 29, 1998·24 cites·12 claims
- 1145US9449890B1Methods for temporary bussing of semiconductor package substratesAMKOR TECHNOLOGY INC·Filed 2013·Granted Sep 20, 2016·0 cites·22 claims
- 1241US6300254B1Methods of making compliant interfaces and microelectronic packages using sameTESSERA INC·Filed 1999·Granted Oct 9, 2001·9 cites·43 claims
- 1341US6170151B1Universal unit strip/carrier frame assembly and methodsTESSERA INC·Filed 1999·Granted Jan 9, 2001·7 cites·7 claims
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