Inventor · disambiguated record
Benson Chan
Also filed as: CHAN BENSON
52 granted patents·2 pending applications·1,506 citations·filing 1994–2021
99Inventor score
Top patents by PatentIndex Score
54 records- 0197US6386890B1Printed circuit board to module mounting and interconnecting structure and methodIBM·Filed 2001·Granted May 14, 2002·129 cites·22 claims
- 0296US7501839B2Interposer and test assembly for testing electronic devicesENDICOTT INTERCONNECT TECH INC·Filed 2006·Granted Mar 10, 2009·39 cites·22 claims
- 0396US6712527B1Fiber optic connections and method for using sameIBM·Filed 2000·Granted Mar 30, 2004·100 cites·23 claims
- 0494US7738249B2Circuitized substrate with internal cooling structure and electrical assembly utilizing sameENDICOTT INTERCONNECT TECH INC·Filed 2007·Granted Jun 15, 2010·32 cites·22 claims
- 0594US6995322B2High speed circuitized substrate with reduced thru-hole stub, method for fabrication and information handling system utilizing sameENDICOTT INTERCONNECT TECH INC·Filed 2004·Granted Feb 7, 2006·72 cites·29 claims
- 0692US7841741B2LED lighting assembly and lamp utilizing sameENDICOTT INTERCONNECT TECH INC·Filed 2007·Granted Nov 30, 2010·54 cites·20 claims
- 0792US6741778B1Optical device with chip level precision alignmentIBM·Filed 2000·Granted May 25, 2004·56 cites·17 claims
- 0892US6224396B1Compliant, surface-mountable interposerIBM·Filed 1999·Granted May 1, 2001·91 cites·29 claims
- 0991US6828514B2High speed circuit board and method for fabricationENDICOTT INTERCONNECT TECH INC·Filed 2003·Granted Dec 7, 2004·47 cites·17 claims
- 1091US6635866B2Multi-functional fiber optic couplerIBM·Filed 2001·Granted Oct 21, 2003·51 cites·23 claims
- 1190US11689115B2Bidirectional AC-DC converter with multilevel power factor correctionUNIV NEW YORK STATE RES FOUND·Filed 2021·Granted Jun 27, 2023·3 cites·20 claims
- 1290US6508595B1Assembly of opto-electronic module with improved heat sinkIBM·Filed 2000·Granted Jan 21, 2003·58 cites·11 claims
- 1389US7541058B2Method of making circuitized substrate with internal optical pathwayENDICOTT INTERCONNECT TECH INC·Filed 2007·Granted Jun 2, 2009·20 cites·18 claims
- 1489US6679707B1Land grid array connector and method for forming the sameIBM·Filed 2002·Granted Jan 20, 2004·50 cites·23 claims
- 1589US5730620AMethod and apparatus for locating electrical circuit membersIBM·Filed 1995·Granted Mar 24, 1998·77 cites·17 claims
- 1688US7441709B2Electronic card assemblyENDICOTT INTERCONNECT TECH INC·Filed 2005·Granted Oct 28, 2008·22 cites·15 claims
- 1788US7142121B2Radio frequency device for tracking goodsENDICOTT INTERCONNECT TECH INC·Filed 2004·Granted Nov 28, 2006·83 cites·8 claims
- 1886US6545226B2Printed wiring board interposer sub-assemblyIBM·Filed 2001·Granted Apr 8, 2003·28 cites·8 claims
- 1986US5793618AModule mounting assemblyIBM·Filed 1996·Granted Aug 11, 1998·71 cites·28 claims
- 2084US7713767B2Method of making circuitized substrate with internal optical pathway using photolithographyENDICOTT INTERCONNECT TECH INC·Filed 2007·Granted May 11, 2010·13 cites·13 claims
- 2180US6964884B1Circuitized substrates utilizing three smooth-sided conductive layers as part thereof, method of making same, and electrical assemblies and information handling systems utilizing sameENDICOTT INTERCONNECT TECH INC·Filed 2004·Granted Nov 15, 2005·20 cites·12 claims
- 2280US6822875B2Assembly of opto-electronic module with improved heat sinkIBM·Filed 2002·Granted Nov 23, 2004·27 cites·2 claims
- 2380US5764071AMethod and system for testing an electronic module mounted on a printed circuit boardIBM·Filed 1996·Granted Jun 9, 1998·49 cites·12 claims
- 2479US6547452B1Alignment systems for subassemblies of overmolded optoelectronic modulesIBM·Filed 2000·Granted Apr 15, 2003·22 cites·12 claims
- 2578US9007202B1Human being tracking and monitoring systemENDICOTT INTERCONNECT TECH INC·Filed 2013·Granted Apr 14, 2015·12 cites·14 claims
- 2678US7679005B2Circuitized substrate with shielded signal lines and plated-thru-holes and method of making same, and electrical assembly and information handling system utilizing sameENDICOTT INTERCONNECT TECH INC·Filed 2006·Granted Mar 16, 2010·8 cites·20 claims
- 2776US9451693B2Electrically conductive adhesive (ECA) for multilayer device interconnectsDAS RABINDRA N·Filed 2011·Granted Sep 20, 2016·2 cites·43 claims
- 2875US6974915B2Printed wiring board interposer sub-assembly and methodIBM·Filed 2004·Granted Dec 13, 2005·16 cites·8 claims
- 2974US7972178B2High density connector for interconnecting fine pitch circuit packaging structuresENDICOTT INTERCONNECT TECH INC·Filed 2010·Granted Jul 5, 2011·4 cites·10 claims
- 3073US7252515B2Non-oriented wire in elastomer electrical contactIBM·Filed 2007·Granted Aug 7, 2007·4 cites·13 claims
- 3173US6349032B1Electronic chip packagingIBM·Filed 1999·Granted Feb 19, 2002·44 cites·11 claims
- 3272US7152319B2Method of making high speed circuit boardENDICOTT INTERCONNECT TECH INC·Filed 2004·Granted Dec 26, 2006·12 cites·12 claims
- 3372US5785535AComputer system with surface mount socketIBM·Filed 1996·Granted Jul 28, 1998·26 cites·9 claims
- 3472US5530291AElectronic package assembly and connector for use therewithIBM·Filed 1995·Granted Jun 25, 1996·35 cites·26 claims
- 3570US6015301ASurface mount socketIBM·Filed 1998·Granted Jan 18, 2000·23 cites·6 claims
- 3669US6892451B2Method of making an interposer sub-assembly in a printed wiring boardIBM·Filed 2003·Granted May 17, 2005·10 cites·18 claims
- 3769US6527457B2Optical fiber guide module and a method for making the sameIBM·Filed 2001·Granted Mar 4, 2003·11 cites·18 claims
- 3868US8502082B2Circuitized substrate utilizing three smooth-sided conductive layers as part thereof and electrical assemblies and information handling systems utilizing sameCHAN BENSON·Filed 2005·Granted Aug 6, 2013·3 cites·17 claims
- 3968US5468996AElectronic package assembly and connector for use therewithIBM·Filed 1994·Granted Nov 21, 1995·28 cites·7 claims
- 4066US6981880B1Non-oriented wire in elastomer electrical contactIBM·Filed 2004·Granted Jan 3, 2006·9 cites·5 claims
- 4164US6848914B2Electrical coupling of substrates by conductive buttonsIBM·Filed 2001·Granted Feb 1, 2005·13 cites·67 claims
- 4261US6652159B2Enhanced optical transceiver arrangementIBM·Filed 2001·Granted Nov 25, 2003·7 cites·33 claims
- 4359US6516129B2Processing protective plug insert for optical modulesJDS UNIPHASE CORP·Filed 2001·Granted Feb 4, 2003·6 cites·19 claims
- 4458US7108809B2Optical coupler replication arrangement and processIBM·Filed 2002·Granted Sep 19, 2006·2 cites·18 claims
- 4556US8069012B2Sampling sufficiency testingCHAN BENSON·Filed 2008·Granted Nov 29, 2011·4 cites·16 claims
- 4655US6676301B2Enhanced optical couplerIBM·Filed 2001·Granted Jan 13, 2004·4 cites·19 claims
- 4751US2006121722A1Method of making printed circuit board with varying depth conductive holes adapted for receiving pinned electrical componentsENDICOTT INTERCONNECT TECH INC·Filed 2006·Application pending·0 cites
- 4848US8028390B2Spring actuated clamping mechanismENDICOTT INTERCONNECT TECH INC·Filed 2008·Granted Oct 4, 2011·0 cites·7 claims
- 4945US7552091B2Method and system for tracking goodsENDICOTT INTERCONNECT TECH INC·Filed 2004·Granted Jun 23, 2009·1 cites·1 claims
- 5044US8196281B2Method of applying force to electrical contacts on a printed circuit boardCHAN BENSON·Filed 2011·Granted Jun 12, 2012·0 cites·7 claims
Showing the top 50 of 54 patent records by PatentIndex Score.
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